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WO/2023/102181A9 |
A copper alloy electrical connector component has a coating thereon formed by applying a nickel layer of between about 5 μin and about 20 μin over the copper alloy; applying a copper layer of between about 7 μin and about 18 μin over...
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WO/2024/062951A1 |
The flux according to the present invention is intended to be used for soldering, and comprises at least one carboxylic acid selected from the group consisting of a dicarboxylic acid having a cyclic structure and a tricarboxylic acid hav...
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WO/2024/057765A1 |
[Problem] To provide a solder wire which has a structure wherein: a resin is coated on a flux layer that is coated on the surface of a solder part for the purpose of preventing adhesion of the flux layer, while taking hygiene and health ...
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WO/2024/054051A1 |
The present invention relates to a composite for a thermal block of a thermal cycler. The composite has both low specific heat characteristics and remarkably improved thermal conductivity, and thus, when the temperature of a thermal bloc...
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WO/2024/043223A1 |
Provided is a flux which is suitable for use in mounting indium sheets, has high wetting properties even in relatively low-temperature bonding, and is more inhibited from forming voids. The flux comprises a rosin, one or more organic aci...
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WO/2024/042663A1 |
This solder alloy can provide a joint part having heat cycle resistance and drop impact resistance, the solder alloy containing 45%-63% by mass of Bi, 0.1% by mass or more and less than 0.7% by mass of Sb, 0.05%-1% by mass of In, and the...
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WO/2024/043231A1 |
Provided is a flux that can suppress the generation of voids when an indium alloy sheet is used to perform a continuous reflow under different temperature conditions. The present invention employs a flux that contains a rosin ester, an o...
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WO/2024/038665A1 |
This electronic device comprises: a first electronic component that has an Ni-based electrode; and a second electronic component that is joined to the Ni-based electrode via Sn-based solder, wherein a (Cu, Ni, Pd)6Sn5 compound layer is p...
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WO/2024/034689A1 |
Provided are a solder alloy, a solder paste, and a solder joint, which exhibit a suitable melting temperature, are excellent in terms of wettability, have high tensile strength and shear strength, and have excellent drop impact resistanc...
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WO/2024/034516A1 |
Provided is an electroconductive paste that makes it possible to improve screen printability, maintain tacking properties, and efficiently dispose solder particles on an electrode. The electroconductive paste according to the present i...
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WO/2024/029258A1 |
Provided are a semiconductor module and a method for manufacturing the semiconductor module that make it possible to prevent voids from occurring by means of a joining layer formed of solder. The semiconductor module comprises a laminate...
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WO/2024/024676A1 |
This flux contains a first solvent and a thixotropic agent. The first solvent either has a viscosity of 10 Pa•s or more at 30°C or is a solid at 30°C, has a boiling point of 200°C or more, and has a weight loss rate of less than 96 ...
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WO/2024/018729A1 |
This semiconductor device is provided with: an electronic component and a substrate, which are arranged so as to face each other in a first direction; and a solder which connects the electronic component and the substrate to each other. ...
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WO/2024/019147A1 |
Flux according to the present invention is characterized by containing rosin, a solvent, a thixo agent, an amine hydriodide, and an active agent (other than the amine hydriodide), the amine hydriodide including a complex alicyclic amine ...
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WO/2024/019149A1 |
A flux according to the present invention contains a rosin, a solvent, a thixo agent, a thiol compound, and an activator, and is characterized in that the thiol compound includes a compound (Tp) having a benzenethiol backbone in which at...
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WO/2023/248302A1 |
The present invention provides a solder bonding member (4) for bonding a first object (2) and a second object (3) to each other, the solder bonding member (4) containing Sn as a main component, while containing not less than 3% by mass b...
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WO/2023/248642A1 |
A laminated bonding material 10 comprises a substrate 11, a first solder part 12a that is laminated on a first surface of the substrate 11, and a second solder part 12b that is laminated on a second surface of the substrate 11, wherein: ...
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WO/2023/243104A1 |
This solder alloy has a liquidus temperature of at most 170ºC and can form a joint part having heat cycle resistance and drop impact resistance. The solder alloy contains 45-63 mass% of Bi, 0.1-1 mass% of Sb, 0.05-1 mass% of Cu, and a t...
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WO/2023/243108A1 |
This solder alloy makes it possible to form a joint part having heat cycle resistance and drop impact resistance, the solder alloy containing 45-63 mass% inclusive of Bi, 0.1-1 mass% inclusive of Sb, 0.05-1 mass% inclusive of In, and a t...
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WO/2023/190263A1 |
The present invention addresses the problem of providing a surface treatment agent that exhibits excellent heat resistance of a chemical conversion film formed on a copper surface and ensures good solderability during soldering. A surfac...
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WO/2023/190475A1 |
[Problem] To provide a mounting substrate that does not easily have a connection failure due to misalignment even when a minute installation component is mounted. [Solution] A mounting substrate according to the present invention is for ...
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WO/2023/181613A1 |
This metallic porous body comprises: metallic skeletons; and partition walls which are integrally formed with the metallic skeletons and which are formed from the same material as that of the metallic skeletons. The metallic porous body ...
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WO/2023/171471A1 |
The present invention provides a flux and a solder paste, which are capable of reducing cracking of a flux residue due to temperature change, while being capable of suppressing separation of a solder paste into a solder powder and a flux...
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WO/2023/139976A1 |
The present invention provides a technology which improves the connection reliability of a solder connection of a semiconductor device in a high temperature environment, while being capable of reducing wet spreading failure of a solder. ...
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WO/2023/139046A1 |
The invention relates to a method for achieving a reliable soldered connection between at least one electronic component with pre-soldered terminal points (BGA) and a printed circuit board for surface mounting. A solder master alloy, whi...
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WO/2023/103289A1 |
A lead-free solder alloy comprises Ag, Cu, Sb, In, Co, B and Sn elements, and the content of each element in weight percentage is: 1.0-4.0% of Ag, 0.2-0.8% of Cu, 1.0-5.0% of Sb, 1.0- 3.0% of In, 0.01-0.5% of Co, and 0.001-0.05% of B and...
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WO/2023/100383A1 |
Provided are a solder alloy, a solder joining member, a solder paste, and a semiconductor package with which it is possible to suppress any separation of a solder joining part and a semiconductor element at the interface between these tw...
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WO/2023/102181A1 |
A copper alloy electrical connector component has a coating thereon formed by applying a nickel layer of between about 5 μin and about 20 μin over the copper alloy; applying a copper layer of between about 7 μin and about 18 μin over...
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WO/2023/097174A1 |
Electrically and thermally conductive compositions for forming interconnections between electronic elements at temperatures below 150°C are provided having two distinct particle Types. The first particle Type comprises a metallic Reagen...
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WO/2023/084949A1 |
This water-soluble flux capable of further suppressing the occurrence of voids contains a keto acid having a melting point of 40°C or lower and a solvent having a boiling point of 240°C or lower.
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WO/2023/080146A1 |
The present invention employs a flux that contains rosin, a terpene phenol resin, and an activator. The terpene phenol resin has a hydroxyl value greater than 70 mgKOH/g. The activator contains an organic acid having a solubility paramet...
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WO/2023/080150A1 |
The present invention employs a flux that contains rosin, a terpene phenol resin, and an activator. The terpene phenol resin has a hydroxyl value greater than 130 mgKOH/g. The activator contains a halogen salt of a primary amine.
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WO/2023/063394A1 |
This antimicrobial substance comprises a base material and a copper-tin alloy layer that is disposed on the base material and that contains 60−90 at% of copper and 10−40 at% of tin with respect to a total of 100 at% of copper and tin...
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WO/2023/063160A1 |
In the present invention, a flux containing an organic acid (AC1), a solvent (S1), and a compound (AZ1) that has a benzotriazole skeleton is employed. The AC1 is such that the rate of decrease in weight when held for 15 minutes at 140°C...
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WO/2023/058450A1 |
This flux contains a chelating agent and an organic acid. The chelating agent contains a compound (C) having a five-member ring structure comprising nitrogen atoms, sulfur atoms, and carbon atoms. The organic acid includes an organic sul...
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WO/2023/053901A1 |
Provided is a bonding material that is capable of suppressing the occurrence of cracking in a bonding part and capable of suppressing the occurrence of cracking in a semiconductor element even when under the load of a particularly high t...
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WO/2023/053722A1 |
Provided is a solder particle manufacturing method, including: a curing step for curing solder particles such that a hardness K value at 70% compressive deformation is 850 N/mm2 to 1,500 N/mm2; and a classifying step for classifying the ...
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WO/2023/054629A1 |
Provided are: a solder alloy having excellent wettability and high reliability by suppressing breakage of a solder joint; and a solder joint. The solder alloy has an alloy composition comprising, by mass%, 1.0-3.7% of Ag, 0.4-0.8% of Cu,...
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WO/2023/052256A1 |
The invention relates to novel low-melting solder alloys for electrical, thermal and mechanical bonding of electronic components to a substrate. The solder alloy according to the invention has an alloy composition consisting of, in % by ...
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WO/2023/054630A1 |
Provided are a solder alloy, solder ball, solder preform, solder paste, and solder joint having excellent wettability and high reliability due to reduced solder joint breakage. This solder alloy has an alloy composition comprising, by ma...
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WO/2023/037747A1 |
The present invention provides an electronic component comprising a component body and an external electrode provided on a surface of the component body, characterized in that the external electrode comprises an Ni/Cu/Sn stacked structure.
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WO/2023/282351A1 |
Provided is a conductive paste that exhibits an excellent conductivity and an excellent long-term reliability. This conductive paste comprises, per 100 parts by mass of a binder component containing an acrylate compound and an epoxy co...
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WO/2023/275215A1 |
The invention is directed to the use of electrolytic bronze deposits as substitutes for the noble metal electroplating of electronic circuits, e.g. for use in electronic payment cards and identity cards. The invention also relates to a n...
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WO/2022/270282A1 |
A solder paste according to the present invention contains a flux composition and a solder powder and is configured such that, with respect to a flux residue that is obtained from this solder paste in accordance with a specific productio...
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WO/2022/270499A1 |
Provided are a flux and a solder paste having good reflow properties and flux residue cleaning properties, wherein changes in viscosity over time upon storage at 30°C are suppressed and coloring of flux residue can be suppressed. A fl...
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WO/2022/269021A1 |
The invention relates to a method for producing a flat steel product (10) having a flat steel base (12) and a zinc- or aluminium-based metal coating (14) on at least one surface (16) of the flat steel base (12), said flat steel base (12)...
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WO/2022/261130A1 |
Some implementations of the disclosure describe a solder paste consisting essentially of: 10 wt% to 90 wt% of a first solder alloy powder, the first solder alloy powder consisting of a Sn-Sb alloy, a Sn-Ag-Cu-Sb alloy, a Sn-Ag-Cu-Sb-ln a...
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WO/2022/260110A1 |
The present invention relates to a lithium ion battery negative electrode active material that includes an Si phase, an Si-Zr compound phase, an Si-X compound phase, and an Sn-Cu compound phase, X being at least one element selected from...
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WO/2022/258783A1 |
Modified Cast Metal Object The invention relates to cast metal objects that are prepared by casting a liquid precursor comprising one or more molten metal and an additive.
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WO/2022/255234A1 |
The present invention uses a flux which contains a rosin, a rosin amine, one or more types of organic sulfonic acid selected from the group consisting of an alkane sulfonic acid, an alkanol sulfonic acid, and an aromatic sulfonic acid, a...
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