Title:
BONDING MATERIAL AND SEMICONDUCTOR PACKAGE
Document Type and Number:
WIPO Patent Application WO/2023/053901
Kind Code:
A1
Abstract:
Provided is a bonding material that is capable of suppressing the occurrence of cracking in a bonding part and capable of suppressing the occurrence of cracking in a semiconductor element even when under the load of a particularly high temperature, said bonding material having a base material part and a solder layer that covers the upper surface and the lower surface of the base material part, wherein the base material part has: a core base material; and a first metal layer and a second metal layer that are on at least one surface of the core base material in this order from the core base material side, and the solder layer comprises a solder alloy containing 1-8 mass% of Cu, 10-30 mass% of Sb, 0.01-0.5 mass% of Ni, and 0.001-0.5 mass% of Co, with the remainder being Sn.
Inventors:
NARUSE SHOUICHIROU (JP)
NAKANO TAKESHI (JP)
SAKAMOTO ISAO (JP)
SHIMADA TOSHIAKI (JP)
OKUBO KOICHI (JP)
NAKANO TAKESHI (JP)
SAKAMOTO ISAO (JP)
SHIMADA TOSHIAKI (JP)
OKUBO KOICHI (JP)
Application Number:
PCT/JP2022/033808
Publication Date:
April 06, 2023
Filing Date:
September 08, 2022
Export Citation:
Assignee:
TAMURA SEISAKUSHO KK (JP)
International Classes:
H01L21/52; B23K35/14; B23K35/26; C22C13/02
Domestic Patent References:
| WO2019088068A1 | 2019-05-09 |
Foreign References:
| JP6871524B1 | 2021-05-12 | |||
| JP2019520985A | 2019-07-25 | |||
| JP2014001439A | 2014-01-09 | |||
| JP2017103434A | 2017-06-08 | |||
| JPS56172938U | 1981-12-21 | |||
| JP2019055410A | 2019-04-11 | |||
| JP6871524B1 | 2021-05-12 |
Attorney, Agent or Firm:
OTA Yoko (JP)
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