Title:
SOLDER ALLOY, JOINT PART, JOINING MATERIAL, SOLDER PASTE, JOINT STRUCTURE, AND ELECTRONIC CONTROL DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/042663
Kind Code:
A1
Abstract:
This solder alloy can provide a joint part having heat cycle resistance and drop impact resistance, the solder alloy containing 45%-63% by mass of Bi, 0.1% by mass or more and less than 0.7% by mass of Sb, 0.05%-1% by mass of In, and the remainder made up of Sn and inevitable impurities, wherein the liquidus temperature is 170°C or less.
Inventors:
SHIMAZAKI TAKANORI (JP)
MARUYAMA DAISUKE (JP)
OCHI GENKI (JP)
ARAI MASAYA (JP)
MARUYAMA DAISUKE (JP)
OCHI GENKI (JP)
ARAI MASAYA (JP)
Application Number:
PCT/JP2022/031965
Publication Date:
February 29, 2024
Filing Date:
August 24, 2022
Export Citation:
Assignee:
TAMURA SEISAKUSHO KK (JP)
International Classes:
C22C12/00; B23K35/26; C22C13/02
Domestic Patent References:
| WO2019171710A1 | 2019-09-12 |
Foreign References:
| CN108546846A | 2018-09-18 | |||
| US20200070287A1 | 2020-03-05 | |||
| CN107984110A | 2018-05-04 | |||
| JP2019527145A | 2019-09-26 | |||
| JP6804126B1 | 2020-12-23 | |||
| JP6477965B1 | 2019-03-06 | |||
| JP6951438B2 | 2021-10-20 |
Attorney, Agent or Firm:
OTA Yoko (JP)
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