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Title:
FLUX AND SOLDER PASTE
Document Type and Number:
WIPO Patent Application WO/2023/058450
Kind Code:
A1
Abstract:
This flux contains a chelating agent and an organic acid. The chelating agent contains a compound (C) having a five-member ring structure comprising nitrogen atoms, sulfur atoms, and carbon atoms. The organic acid includes an organic sulfonic acid.

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Inventors:
INOUE KENTA (JP)
TAKAGI TOMOKO (JP)
Application Number:
PCT/JP2022/035051
Publication Date:
April 13, 2023
Filing Date:
September 21, 2022
Export Citation:
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Assignee:
SENJU METAL INDUSTRY CO (JP)
International Classes:
C22C12/00; B23K35/26; B23K35/363; C22C13/02
Domestic Patent References:
WO2008105397A12008-09-04
Foreign References:
CN104551451A2015-04-29
CN107150190A2017-09-12
JP2021164791A2021-10-14
JP2002361484A2002-12-18
Attorney, Agent or Firm:
OIKAWA Shu et al. (JP)
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