Title:
CONDUCTIVE PASTE AND MULTILAYER SUBSTRATE USING SAME
Document Type and Number:
WIPO Patent Application WO/2023/282351
Kind Code:
A1
Abstract:
Provided is a conductive paste that exhibits an excellent conductivity and an excellent long-term reliability. This conductive paste comprises, per 100 parts by mass of a binder component containing an acrylate compound and an epoxy compound, 600-1200 parts by mass of high melting point metal particles comprising silver-coated copper alloy particles, 900-1500 parts by mass of low melting point metal particles having a melting point not greater than 180°C, 0.5-30 parts by mass of a curing agent, and 1-100 parts by mass of a flux.
Inventors:
FUJIKAWA RYOTA (JP)
YAMAMOTO MASAHIRO (JP)
YAMAGUCHI NORIHIRO (JP)
YAMAMOTO MASAHIRO (JP)
YAMAGUCHI NORIHIRO (JP)
Application Number:
PCT/JP2022/027127
Publication Date:
January 12, 2023
Filing Date:
July 08, 2022
Export Citation:
Assignee:
TATSUTA ELECTRIC WIRE & CABLE CO LTD (JP)
International Classes:
H01B1/22; B22F1/00; B22F1/107; B22F1/17; B22F9/00; C22C9/04; C22C9/06; C22C12/00; C22C13/02; H05K3/46
Domestic Patent References:
| WO2003105160A1 | 2003-12-18 |
Foreign References:
| JP2020152778A | 2020-09-24 |
Attorney, Agent or Firm:
TSUTADA & CO. (JP)
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