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WO/2020/176583A1 |
High reliability leadfree solder alloys for harsh service conditions are disclosed. In some embodiments, a solder alloy comprises 2.5-4.0 wt% Ag; 0.4-0.8 wt% Cu; 5.0-9.0 wt% Sb; 1.5-3.5 wt% Bi; 0.05-0.35 wt% Ni; and a remainder of Sn. In...
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WO/2020/158685A1 |
The Sn particles of the present invention contain greater than or equal to 40 mass% of Sn and less than or equal to 0.55 mass% of oxygen (O), and have a ratio (mass%・g/m2) of oxygen content (mass%) to BET specific surface area (m2/g) o...
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WO/2020/157168A1 |
Disclosed is a process producing soft lead (27), hard lead (28) and tin (20), comprising a) a first distillation (200) of solder (6) comprising Pb+Sn+Sb, producing a first lead overhead (7) and a first tin bottom (8), b) optionally a cry...
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WO/2020/157167A2 |
Disclosed is a process for the separation by fractional crystallisation (300) of a molten crude tin mixture (8) containing lead and silver, into a first silver-enriched liquid drain product (9) at the liquid end of the crystallisation st...
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WO/2020/158660A1 |
Provided is a highly reliable solder joint. This solder joint includes: a solder joining layer in which a solder material has been melted, said solder material having Sn as the primary component thereof and further including Ag and/or ...
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WO/2020/153418A1 |
A flux according to the present invention is used for soldering, and contains: a thixotropic agent which contains a polyamide compound that has UV absorption over the wavelength range of 240-500 nm in the ultraviolet absorption spectrum;...
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WO/2020/137726A1 |
A copper alloy plate which contains, at the thickness center thereof as observed in the plate thickness direction, 0.3 to 1.2% by mass inclusive of Mg and 0.001 to 0.2% by mass inclusive of P, with the remainder made up by Cu and unavoid...
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WO/2020/135932A1 |
A lead-free solder alloy comprising: from 1 to 9 wt.% copper, at least one of: from greater than 0 to 1 wt.% nickel, from greater than 0 to 10 wt.% germanium, from greater than 0 to 1 wt.% manganese, from greater than 0 to 10 wt.% alumin...
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WO/2020/137535A1 |
In order to make it possible to achieve thermal fatigue resistance even in environments having extremely severe differences in temperature such as between -40ºC and 175ºC and minimize the development of cracks occurring in a solder joi...
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WO/2020/131360A1 |
The International Bureau acknowledges receipt of Article 19 amendments received on 12 November 2019 (12.11.2019). Although the applicant appears to have indicated the basis of the amendment in the application as filed in the cover letter...
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WO/2020/122253A1 |
Provided is a solder alloy, a solder paste, a solder preform, and a solder joint which suppress chip cracks during cooling, improve heat dissipation characteristics of the solder joint, and also display a high degree of joining strength ...
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WO/2020/115653A1 |
Active soft solder for ultrasonic soldering, mainly of non-metal and metal materials, or two non-metal materials, at higher application temperatures, is on the basis of tin and it contains an antimony and an active metal, whereby the sha...
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WO/2020/116372A1 |
The purpose of the present invention is to provide a flux capable of sufficiently improving the wettability of a solder alloy that does not contain Ag. The foregoing can be achieved by a flux which contains an acid-modified rosin or chlo...
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WO/2020/116631A1 |
This method for producing a positive electrode active material for a lithium secondary battery is characterized by including a calcination step for performing calcination, using a calcination means, on a mixture of a composite metal comp...
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WO/2020/116388A1 |
This compound contains Sn, Te, and Mn, and further contains Sb and/or Bi.
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WO/2020/116403A1 |
The present invention addresses the problem of providing a flux sheet which exhibits strong adhesion to a substrate, while being free from displacement of a solder ball during a reflow process. In order to solve the above-described probl...
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WO/2020/116366A1 |
This compound contains Sn, Te, and Mg, and further contains Sb and/or Bi.
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WO/2020/111273A1 |
In the present invention, corrosion of a nozzle used in a spot solder bath, for instance, can be inhibited by a lead-free solder alloy containing 0.3 to 4.0 mass% of Ag, 0.1 to 2.0 mass% of Cu, 0.005 to 0.05 mass% of Fe, 0.01 to 0.5 mass...
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WO/2020/095892A1 |
Provided is flux that can be discharged using an inkjet method and that is capable of bonding to an adherend after application. This flux includes 5-50 mass% of a solid solvent having a melting point of 60°C or less, 50-80 mass% of a so...
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WO/2020/095734A1 |
This precursor is a wire-drawing processed part of a composite tube comprising a composite wire rod group, a barrier layer, and a protective layer, the composite wire rod group comprising a plurality of tin wire rods having one or a plur...
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WO/2020/083529A1 |
A solder alloy comprising: from 40 to 65 wt.% bismuth; from 1 to 10 wt.% indium; at least one of: from 0.1 to 5 wt.% gallium, from 0.1 to 5 wt.% zinc, from 0.1 to 2 w.% copper, from 0.01 to 0.1 wt.% cobalt, from 0.1 to 2 wt.% silver, fro...
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WO/2020/085333A1 |
A flux which contains an organic acid, a solvent and a polyoxyethylene behenyl alcohol that has an average number of moles of added ethylene oxide of 7-40 mol.
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WO/2020/079147A1 |
The invention relates to a lead-free solder alloy having a composition comprising: - 86% - 94% by weight of tin (Sn), - 5% - 10% by weight of antimony (Sb) and - 0.5% - 4% by weight of copper (Cu).
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WO/2020/066489A1 |
A solder composition according to the present invention is characterized by comprising: a flux composition containing (A) a rosin resin, (B) an activator, and (C) a solvent; and (D) a solder powder having a melting point of 200-250°C, w...
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WO/2020/066164A1 |
A solder material comprises 0.5% (% by weight, same as below) or more and less than 2.5% of Ag, 0.3 to 0.5% of Cu, 5.5 to 6.4% of In and 0.5 to 1.4% of Sb, with the remainder made up by unavoidable impurities and Sn. Alternatively, the s...
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WO/2020/067307A1 |
This lead-free solder alloy exhibits extremely favorable creep characteristics as a result of the added quantity of Cu being 0.1-2.0 mass%, the added quantity of Ni being 0.01-1.0 mass% and the added quantity of Ge being 0.001-2.0 mass%,...
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WO/2020/059461A1 |
The purpose of the present invention is to provide a composition for sealing which can be handled in a semi-cured state and can provide a sintered body having excellent bonding strength and sealing performance. A composition for sealing ...
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WO/2020/054288A1 |
Provided is a conductive material, the storage stability of which can be efficiently increased and which can be densely filled with flux, and which can also efficiently increase solder coalescing properties during conductive connection. ...
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WO/2020/054581A1 |
One aspect of the present invention is a method of manufacturing an electronic component, the method comprising: a first step of applying a metal paste containing metal particles onto a polymer compact in a prescribed pattern to form a m...
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WO/2020/047481A1 |
Some implementations of the disclosure are directed to low melting temperature (e.g., !iquidus temperature below 210°C) SnBi or Snln solder alloys. A SnBi solder alloy may consist of 2 to 60wt% Bi; optionally, one or more of: up to 16 w...
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WO/2020/031825A1 |
Provided is a flux composition that can be coated without performing a film forming step, and also provided are a soldering paste, a solder joint, and a solder joining method, which use this flux composition. This flux composition compri...
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WO/2020/031693A1 |
This flux contains a solvent and a thixotropic agent, wherein the solvent contains a carboxylic acid that is a liquid at ordinary temperature.
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WO/2020/031361A1 |
The invention of the present application addresses the problem of providing a lead-free solder alloy, which does not undergo the occurrence of cracking at a solder joint part even under such a severe environment (-40°C to 150°C) where ...
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WO/2020/021967A1 |
Provided are a soldering alloy and a solder joint which have high tensile strength and which can suppress Ni erosion while suppressing the occurrence of a void in the joining interface. This soldering alloy has an alloy composition compr...
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WO/2020/017154A1 |
This solder alloy is characterized by having an alloy composition of As: 25-300 ppm by mass, Pb: greater than 0 and less than or equal to 5100 ppm by mass, at least one of Sb: greater than 0 and less than or equal to 3000 ppm by mass and...
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WO/2020/017064A1 |
This composition contains: a metal component which can undergo transitional liquid-phase sintering; and an organic component. The metal component contains: metal particles A having a melting point higher than 300°C; and metal particles ...
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WO/2020/017157A1 |
This solder alloy has an alloy composition of As: 25-300 ppm by mass, Bi: 0-25,000 ppm by mass and Pb: greater than 0 and less than or equal to 8000 ppm by mass, with the remainder consisting of Sn, and satisfies formula (1) and formula ...
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WO/2020/012226A1 |
The present application concerns an additivated solder paste and a process to apply a reactive additive element for the control of the soldering temperature of electronic components on the reflow soldering method by the use of metallic p...
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WO/2020/004510A1 |
A method for producing an anisotropic conductive film, which comprises: a preparation step wherein a base material that has a plurality of recesses and solder fine particles are prepared; a containing step wherein at least some of the so...
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WO/2020/004511A1 |
A method for producing solder particles, which comprises: a preparation step wherein a base material that has a plurality of recesses and solder fine particles are prepared; a containing step wherein at least some of the solder fine part...
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WO/2020/004513A1 |
The present invention relates to solder particles, each of which partially has a flat portion in the surface. By using these solder particles, electrodes facing each other are able to be appropriately connected, thereby achieving an anis...
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WO/2020/004512A1 |
The present invention relates to a solder paste which contains solder particles and a flux. A part of the surface of the solder particles has a flat portion. By using solder particles having a flat portion on a part of the surface thereo...
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WO/2019/235001A1 |
Provided are: a lead-free solder alloy, which is a means that can achieve both of a cracking propagation prevention effect and resistance to impact associated with high-speed deformation at a solder joint part under an environment where ...
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WO/2019/230694A1 |
Provided are: a flux that is for a solder paste and that can inhibit occurrence of voids; and a solder paste using the flux. This flux for a solder paste contains rosin, an imidazole compound, and a solvent, wherein the contained amount ...
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WO/2019/231749A1 |
A lead-free solder preform includes a core layer and adhesion layer coated over surfaces of the core layer, where the preform delivers the combined merits from constituent solder alloys of the core and adhesion layers to provide both hig...
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WO/2019/216291A1 |
The present invention includes an iodine-containing cyclic compound which has, in a single molecule, a single ring structure or a plurality of ring or a plurality of ring structures which form a fused ring. The ring of the ring structure...
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WO/2019/208775A1 |
A hot-dip Sn-Zn-alloy-plated steel sheet according to an embodiment of the present invention is provided with: a steel sheet having predetermined chemical components; a diffusive alloy layer disposed on one surface and/or on both surface...
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WO/2019/198690A1 |
Provided is a solder paste that shows reduced void formation and has a high reliability. The solder paste comprises an Sn-based powder, an SnSb-based alloy powder containing Sn and 10 mass% or more of Sb, and a flux, wherein: the liquid ...
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WO/2019/187448A1 |
A sliding member according to the present embodiment comprises a back metal layer, a bearing alloy layer, and an intermetallic compound. The bearing alloy layer is layered upon the back metal layer and forms a sliding surface on the side...
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WO/2019/188756A1 |
Provided is a solder paste which uses a conventional flux, and for which long-term preservation is made possible and an easy preservation method can be realized by suppressing changes in the viscosity of the paste over time. This solder ...
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