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WO/2001/070448A1 |
A lead-free solder alloy, characterized as having the following composition: Cu: 0.05 to 2.0 wt %, Ni: 0.001 to 2.0 wt %, balance: Sn. The solder alloy is completely free of Pb, and hence does not cause the environmental pollution by Pb....
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WO/2001/054851A2 |
A piezoelectric ceramic ink-jet print head is made by an ultrasonic bonding process. Several improved features of ink jet print heads include a more cost-effective bonding process using an ultrasonic bonding technique, an improved piezoe...
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WO/2001/047014A1 |
An organic carrier member for mounting a semiconductor device is provided that has a plurality of pin leads joined to conductive pads by an internal conductive layer. The pin leads are embedded in the organic carrier member and joined to...
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WO/2001/034860A1 |
The invention relates to a soldering alloy consisting of an element or a mixture of elements chosen from the following group: copper, silver and antimony, this element or mixture of elements totalling 0.1 to 40 wt. %, as the first compon...
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WO/2001/031074A1 |
A metal alloy for realizing electrical connections with pratically nul contact tension, comprising the following components, possibly alternative, with the relative percentages: tin 45-95 %, antimony 1-20 %, copper 1-20 %, lead 0-50 %, s...
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WO/2001/013687A1 |
The invention concerns a method for assembling electronic components (4) with copper pins (2), on a support comprising a step which consists in soldering the pins (2) of each component (4) on the support, with a lead-free soldering mater...
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WO/2001/003878A1 |
A lead-free solder alloy suitable for use in wave soldering and, in particular with water base VOC-free flux, low-VOC (water base) flux and low solids (solvent base flux consists of tin to which is/are added one or more of Ag in an amoun...
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WO/2001/003873A1 |
A method for plugging a hole, particularly a hole provided in a cooling element, in which method in a hole (9) formed in a piece essentially made of mainly copper, for instance in the housing element (2) of a cooling element (1), there i...
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WO/2000/076717A1 |
A lead-free solder which comprises substantially Sn and Ti and has a liquidus line temperature of 400°C or lower. The solder is free of lead which is a hazardous substance and also exhibits a satisfactory bonding strength toward an oxid...
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WO/2000/075940A1 |
An electronic component which is friendly to the global environment and which possesses improved reliability of the junction between external terminals of the electronic component and a circuit pattern on a printed circuit board. An elec...
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WO/2000/054927A1 |
A leadless solder, characterized as containing Sn and Zn, and further containing 0.001 to 3.0 wt.% of Ti. The solder is free of hazardous lead and exhibits satisfactory bonding strength to oxide materials such as glass, ceramics and the ...
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WO/2000/048784A1 |
Tombstoning susceptibility and reflow peak temperature reduction of solder alloys, in particularly lead-free solder alloys, has been found to be achieved effectively by mixing the solder alloy in the form of an alloy paste with a low mel...
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WO/2000/047788A1 |
The invention relates to a plain bearing for the pivots of the rollers of gliding mechanisms, comprising a metal bearing bush (1) and a plain bearing alloy (2) on a tin basis with antimony and copper, which alloy is introduced into the b...
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WO/2000/024544A1 |
A lead-free solder characterized as comprising 0.1 to 2 wt % of Cu, 0.002 to 1 wt % of Ni with the residue being Sn. The solder preferably contains Cu in an amount of 0.3 to 0.7 wt %, and more preferably it contains Cu in an amount of 0....
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WO/2000/017948A1 |
An electrode material for a negative pole of a lithium secondary battery containing particles which comprises an amorphous Sn.A.X alloy having a substantially non-stoichiometric composition, wherein A represents at least one element sele...
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WO/1999/055924A1 |
A wheel weight suitable for balancing the wheels of automobiles which comprises an alloy of tin having a melting range with an upper limit of below approximately 320 °C and a hardness of at least approximately 6Hv.
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WO/1999/048639A1 |
Ternary leadless solder comprising l-2 wt.% of Cu, 0.002-l wt.% of Ni, and Sn for the rest, wherein the contents of Cu and Ni are preferably 0.3-0.7 wt.% and 0.04-0.l wt.% respectively, a method of adding Ni to a Sn-Cu alloy and a method...
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WO/1999/030866A1 |
A Pb-free solder-connected structure having a sufficiently large connection strength, featuring an interface that remains stable even after the passage of time, and maintaining sufficient wettability and resistance against whiskers, and ...
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WO/1999/004048A1 |
This invention relates to a lead antimony free solder composition. The alloy components, based on the total weight of alloy, fall in the following ranges: Ag 2.0 - 5.0 % by weight, Cu 0.3 - 2.0 % by weight, Bi 0.5 - 7.0 % by weight, Sn 9...
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WO/1998/048069A1 |
A solder composition comprising: 15.0 to 30.0 % bismuth; 1.0 to 3.0 % silver, and optionally comprising 0 to 2.0 % copper and 0 to 4.0 % antimony and incidental impurities, the balance being tin.
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WO/1998/032886A1 |
A lead-free tin alloy for solder joints comprising up to 0.25 % by weight of indium and a grain refiner which is an alloy consisting of, by weight, 2.5 to 10 % aluminium, 1 to 5 % magnesium and balance zinc. The alloys have improved mech...
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WO/1998/008362A1 |
A composition for use in the production of metal traces and other metal components of printed circuit boards, wiring boards and the like comprises the following components: (a) a metal powder, (b) a solder powder, (c) a polymer or a mono...
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WO/1997/047426A1 |
A high solidus temperature, high service temperature, high strength ternary solder alloy, solder paste and method. The alloy contains a major proportion of tin of at least about 70 % by weight, a selectively limited amount of silver from...
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WO/1997/047425A1 |
A high solidus temperature, high service temperature, high strength ternary solder alloy, solder paste and method. The alloy contains a major proportion of tin, from about 5 to 27.5 wt.% bismuth and 2 to 7.5 wt.% silver.
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WO/1997/043456A1 |
Lead-free solders are disclosed having relatively low melting temperatures, a small melting range, a small solidification range and a good flux response, making such alloys suitable for soldering and joining applications. The alloy compo...
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WO/1997/028923A1 |
Solder and solder paste used for soldering an electronic part to a circuit board. This solder comprises 2.0-3.5 wt.% of Ag, 5-18 wt.% of Bi, and Sn for the rest. In another embodiment, the solder further contains at least one kind of ele...
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WO/1997/027395A1 |
A fuel filter is described which has a formulation of a stable intermetallic compound of materials such as tin and antimony. The filter may have an integral porous structure or may be in the form of particles. It removes trace metal ions...
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WO/1997/013000A1 |
An amalgam for use in fluorescent lamps comprising lead, tin and mercury together with another metal selected from the group consisting of silver, magnesium, copper, gold, platinum and nickel. The amalgam has the characteristic of partia...
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WO/1997/009455A1 |
The inventive soldering compositions all contain a tin-silver-copper base. To this base are added varying combinations of indium, antimony, zinc and/or bismuth to form soldering compositions having the desirable properties described here...
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WO/1997/003789A1 |
The invention, which enables wider use to be made of soft-soldering techniques, concerns an alloy, in particular a solder alloy, a method of joining workpieces by soldering using the solder alloy and the use of the alloy for soldering. T...
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WO/1996/022832A1 |
A composition for use as a reduction catalyst, comprising a support consisting of at least one oxide selected from oxides that are inert or inertable with respect to the reaction mixture, and a phase at least partially covering said supp...
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WO/1995/034401A1 |
A solder alloy having higher mechanical strengths and excellent wettability, which comprises 0.0005 to 0.35 wt.% of Si, 0 to 5.0 wt.% of Ag, 0 to 10.0 wt.% of Sb, 0 to 10.0 wt.% of Bi, 20 to 95 wt.% of Sn, 0 to 70 wt.% of Pb and 0 to 0.5...
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WO/1995/028249A1 |
An object of the present invention is to provide solder in which bridges rarely occur. Solder having a solid phase temperature and a liquid phase temperature different from each other is used. Since such solder is not wholly melted immed...
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WO/1995/018696A1 |
A soldering composition consisting essentially of an alloy comprising tin, indium, antimony, silver and in the range of 0.0 % to about 10.5 % by weight bismuth.
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WO/1994/025634A1 |
A lead-free and bismuth-free solder alloy composition for electronic assembly applications having reduced toxicity. The alloy composition consists of, in weight percent, 90.3-99.2 % tin, 0.5-3.5 % silver, 0.1-2.8 % copper, and 0.2-2.0 % ...
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WO/1994/008061A1 |
A method of producing a sintered metal component from powder comprises mixing a high alloy steel powder with a low alloy steel or an iron powder in the presence of a free carbon powder in the range 0.1 to 1.5 wt %, optionally with a lubr...
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WO/1993/007369A1 |
An engine block (10) for an internal combustion engine including at least one bore (18), and a cylindrical liner (20) that is pressed into the bore (18) to define the inner cylindrical surface (24) along which the piston (34) reciprocate...
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WO/1992/017617A1 |
A low temperature solder and method for soldering an oxide layer-building metal such as aluminum, titanium, tantalum or stainless steel. The composition comprises tin and zinc; germanium as a wetting agent; preferably small amounts of co...
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WO/1983/003163A1 |
A Pb alloy solder which contains 1 to 65 % by weight of one or both of Sn and In, the residue being composed of Pb and unavoidable impurities, with less than 50 ppb of radioisotopes as unavoidable impurities, so that a count of the numbe...
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WO/1981/001983A1 |
Coated article and method for producing the coated article. The article (1) is coated with a system which provides protection against oxidation and corrosion and which significantly reduces the substrate temperature. An MCrAlY layer (2) ...
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WO/1981/001982A1 |
Coated article and method for producing the coated article. The article (1) is coated with a system which provides protection against oxidation and corrosion and which significantly reduces the substrate temperature. An MCrAlY layer (2) ...
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JP7474797B2 |
To provide a solder alloy that can suppress re-melting of a solder joint to be formed in high temperature environments.A solder alloy contains 0.1-3 mass% of Ag, 8-15 mass% of Cu and 30-40 mass% of Sb, with the remainder being Sn.SELECTE...
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JP7474029B2 |
To provide a conductive material that allows solder to be efficiently disposed on an electrode, and can effectively improve conduction reliability between vertical electrodes to be connected.A conductive material has a thermosetting comp...
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JP2024054108A |
[Problem] To provide a conductor that has sufficient conductivity and whose resistance value does not easily increase even when subjected to temperature changes, a substrate having a through electrode that has sufficient conductivity and...
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JP2024050383A |
[Problem] Embodiments of the present invention reduce the amount of RH used or do not use RH while providing high HcJThe present invention provides a method for manufacturing an RTB-based sintered magnet and an RTB-based sintered magnet ...
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JP2024515499A |
A solder material for use in an electronic assembly, the solder material comprising a solder layer. and a core layer comprising a core material, the core layer being sandwiched between solder layers; A solder material in which the therma...
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JP2024512242A |
Some variants are carbon negative carbon products, with 0 kg CO per metric ton of carbon negative carbon products.2A carbon negative carbon product is provided that is characterized by a carbon strength of less than e and contains at lea...
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JP2024035412A |
An object of the present invention is to provide a solder composition that has excellent stability over time even when using sufficiently fine solder powder. [Solution] A flux composition containing (A) a rosin resin, (B) an activator, (...
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JP2024031830A |
An object of the present invention is to provide a flux composition that can sufficiently suppress the generation of solder balls despite being halogen-free or non-halogen type. A flux composition containing (A) a resin and (B) an activa...
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JP2024026932A |
[Problem] The occurrence of shrinkage cavities can be suppressed. [Solution] An electronic device includes a first electronic component having a Ni-based electrode and a second electronic component joined to the Ni-based electrode via Sn...
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