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WO/2010/055863A9 |
Disclosed is a negative electrode structure for a lithium ion secondary battery having high stability. Specifically disclosed is a negative electrode structure for a lithium ion secondary battery, which comprises an electrode composed of...
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WO/2011/030538A1 |
Provided is an antimicrobial raw material having excellent antibacterial and corrosion-resistance properties, which can be directly formed as a film even on a plastic substrate with low heat-resistance or a substrate whereof the color or...
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WO/2011/027659A1 |
Disclosed is a soldering paste that has excellent strength at high temperatures, has favorable diffusion of a first metal and a second metal during a soldering step, generates an intermetallic compound having a high melting point at a lo...
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WO/2011/023394A1 |
The present invention relates to a novel lead-free solder alloy and to the use thereof The soft solder having a low degree of leaching of copper, is forming a barrier layer, during the soldering operation, at the interface between the so...
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WO/2011/001818A1 |
Disclosed is a semiconductor device wherein flash is suppressed when reflow soldering is performed, stability of a semiconductor element connecting interface is ensured, and connection reliability with respect to thermal stress is improv...
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WO/2010/150860A1 |
Disclosed are a cooling device for refractory furnace walls and a cooling method using said device, which curb the speed of erosion within a furnace, improve the durability of refractory material and extend the life of refractory furnace...
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WO/2010/122764A1 |
A lead-free soldering material which shows high thermal fatigue resistance and with which it is possible to effectively reduce the occurrence of connection failures that cause a function of a product to stop. The soldering material compr...
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WO/2010/119836A1 |
Disclosed are: a lead-free solder alloy which enables the prevention of the occurrence of yellow discoloration on the surface of a solder after soldering, the surface of a solder bump after the formation of the bump in a BGA, and the sur...
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WO/2010/100855A1 |
A mounted structure (1) wherein an electronic component (5) is surface-mounted on a wiring board (2) with solder (4). The solder is an Sn-Ag-Bi-In-based solder comprising 0.1 to 5 wt% of Bi, more than 3 wt% and less than 9 wt% of In, and...
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WO/2010/089840A1 |
Disclosed are: a product having a gadolinium-containing alloy metal layer that exhibits excellent corrosion resistance, said product being suitable for an electrical/electronic member; and a method for producing the product having a gado...
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WO/2010/087316A1 |
Disclosed is a flux composition for a lead-free solder, which contains 8-65% by weight of dehydroabietic acid and 8-67% by weight of dihydroabietic acid relative to the total amount of the composition. The flux composition is capable of ...
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WO/2010/087241A1 |
Provided are a low-silver lead-free solder alloy which has excellent wetting properties and excellent thermal fatigue characteristics; a solder-paste type soldering material and a flux-cored soldering material which exhibit excellent fat...
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WO/2010/060299A1 |
A reducing dross method of lead-free solder includes the steps of: producing master alloy of reducing dross which comprises Sn and 0.1 to 0.8 wt % P; analyzing the percentage of P in the lead-free solder to be modified, in order to reach...
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WO/2010/047139A1 |
A solder alloy (3) comprises 5-15% by mass Sb, 3-8% by mass Cu, 0.01-0.15% by mass Ni, and 0.5-5% by mass In. The remainder comprises Sn and unavoidable impurities. Thus it is possible to obtain a highly reliable solder alloy (3) and a s...
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WO/2010/044751A1 |
A solder alloy having a composition comprising at least two eutectic alloy compositions is provided. A method of joining two workpieces with the use of the solder alloy is also provided.
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WO/2010/038668A1 |
A flux for soldering and a soldering paste containing the flux are provided, the paste suffering no viscosity change with time and neither filming nor becoming non-flowable. The soldering paste has satisfactory applicability, printabili...
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WO/2009/151123A1 |
Disclosed is a method for joining a substrate and an object to be mounted using a solder paste. In the method, the solder paste is mounted or applied between a metalized layer formed on the substrate and a metalized layer formed on the ...
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WO/2009/131178A1 |
Disclosed is a lead-free solder alloy having improved surface properties, which is suppressed in occurrence of fine recesses/projections or shrinkage cavity. The lead-free solder alloy has a composition consisting of 0.1-1.5% of Ag, 2.5-...
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WO/2009/131114A1 |
Disclosed is a low-cost lead-free solder having good wettability and impact resistance, wherein occurrence of tin pest is prevented at extremely low temperatures. The lead-free solder has a composition consisting of, in mass%, 0.5-0.8% o...
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WO/2009/122912A1 |
Disclosed is a solder structure which suppresses formation of Sn whiskers in an Sn alloy solder. A method for forming the solder structure is also disclosed. A solder structure (2) is composed of an Sn alloy (4) which can be in a solid-l...
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WO/2009/111932A1 |
A lead-free high-temperature electronic solder comprises, by mass, 8 to 22% Sb, 0.5 to 8% Cu and the balance Sn; 8 to 22% Sb, 0.5 to 8% Cu, 0.01 to 2% Ni and the balance Sn; or 8 to 22% Sb, 0.5 to 8% Cu, 0.01 to 2% Ni, 0 to 0.01% at leas...
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WO/2009/110484A1 |
A non-aqueous electrolyte secondary battery includes a metal outer package container, an electrode group housed in the metal outer package container and comprising a positive electrode, a negative electrode having an active material whic...
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WO/2009/108975A1 |
The invention relates to a plain bearing alloy consisting of a tin-based white metal and containing antimony as the primary alloy element and between 1 and 10 % by weight copper. The aim of the invention is to achieve excellent strength ...
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WO/2009/104294A1 |
A molten lead-free solder alloy comprising tin as a main component and at least one metal selected from silver, copper, zinc, bismuth, antimony, nickel, and germanium added to the tin is immersed in a solution of an oil containing 5 to 8...
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WO/2009/075314A1 |
A lead-free solder alloy is provided which has bonding reliability and eliminates the problem that conventional lead-free solder alloys are inferior in bond strength to lead-containing solder alloys. The solder alloy is characterized by ...
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WO/2009/051240A1 |
Although a lead-free soft solder having a composition of Sn-3Ag-0.5Cu is regarded as very likely, this soft solder suffers from the coarsening of Ag3Sn grains when exposed to high -temperature atmosphere, thus being problematic in the re...
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WO/2009/051181A1 |
Disclosed is a solder jointed article in which the occurrence cracking is suppressed. Specifically disclosed is a lead-free solder alloy comprising 0.01 to 7.6 wt% of Cu and 0.001 to 6 wt% of Ni, with the remainder being Sn. The alloy al...
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WO/2009/051255A1 |
Disclosed is a solder join in which the occurrence of cracking is suppressed. A joint is produced from a solder alloy comprising 0.01 to 7.6 wt% of Cu and 0.001 to 6 wt% of Ni, with the remainder being Sn. The alloy allows the maximum ra...
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WO/2009/028147A1 |
A bonding composition (12) contains Ge of 0.01-1 wt% and Si of 0.01-1 wt%, and the rest is composed of a Sn alloy. The bonding composition (12) has excellent bonding strength.
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WO/2009/028143A1 |
A hydrogen gas generating member adapted to safely promote a hydrogen gas generating reaction through contact of an Al alloy having undergone rolling treatment or pulverization treatment with water. There is provided a hydrogen gas gener...
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WO/2009/025207A1 |
Disclosed is a low-cost, highly productive powder for a negative electrode material for lithium ion batteries having good battery capacity. This powder for a negative electrode material for lithium ion batteries is composed of a Co-Sn-Fe...
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WO/2009/011341A1 |
Disclosed is an Sn-Ag-Cu-Bi lead-free solder having excellent heat cycle resistance and mechanical strength, which can be used for soldering of an in-vehicle electronic circuit. The solder comprises the following components: Ag: 2.8-4 ma...
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WO/2009/011392A1 |
Disclosed is a lead-free solder alloy having high reliability, which can be used for soldering an on-vehicle electronic circuit.Specifically disclosed is a lead-free solder alloy containing 2.8-4% by mass of Ag, 3-5.5% by mass of In, 0.5...
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WO/2009/008127A1 |
A thermoelectric conversion module (10) comprises a first electrode member (13) arranged on the low temperature side, a second electrode member (14) arranged on the high temperature side, and p-type and n-type thermoelectric elements (11...
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WO/2009/008383A1 |
This invention provides electroconductive fine particles which can reduce a connection resistance value and can realize high connection reliability, and an anisotropic electroconductive material and a connection structure using the elect...
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WO/2008/149910A1 |
Disclosed is a method for producing a thermoelectric conversion element, which comprises the steps of: preparing a solution containing a salt of an element constituting a thermoelectric conversion material; adding the solution drop-wise ...
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WO/2008/140435A1 |
The invention relates to the chemical, petrochemical and petroleum-refining industry. The inventive composite material is produced in the form of tightly sealed capsules which are filled with a bismuth-, lead-, stannum- and cadmium-based...
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WO/2008/132933A1 |
This invention provides elecroconductive fine particles, which are used in electroconductive connection between fine electrodes, are less likely to cause cracking of a soldering layer and disconnection caused by failure of the interface ...
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WO/2008/111617A1 |
The problem of diffusion of Cu of slide bearing copper alloy (lining) being quantitatively predominant in slide bearing layer structures into Sn overlay to thereby deteriorate the performance of the overlay is coped with by an improvemen...
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WO/2008/111615A1 |
[PROBLEMS] To provide an anisotropic electroconductive material which can solve problems of the conventional anisotropic electroconductive material using low-melting particles as electroconductive particles that the electroconductivity b...
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WO/2008/088790A1 |
A compound, such as an organic compound, can be transformed utilizing a melted metal alloy by generating an energy gradient in a system that includes the compound and the alloy. Accordingly, provided are methods for transforming compound...
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WO/2008/084603A1 |
An SnCu based lead-free solder alloy for manual soldering that enables production of a solder of stable composition with resistance to soldering iron tip thinning nearly equivalent to that of Sn37Pb (eutectic alloy). The SnCu based lead-...
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WO/2008/078653A1 |
It is intended to provide a high-temperature lead-free solder alloy which shows well-balanced strength and soldering characteristics without any variation in the strength in a soldered part, and a method of producing the same. Namely, an...
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WO/2008/074344A1 |
Sliding bearing (10) comprising a back metal layer (12), a bearing layer (14) applied to the back metal layer (12), at least one intermediate layer (16) applied to the bearing layer (14) and an overlay (18) applied to the at least one in...
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WO/2008/073090A1 |
A solder alloy suitable for high temperature environments, such as for example electronic systems used in an oil or gas well where the temperature may be in the region of 175°C, the solder alloy having a Silver weight % in the range of ...
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WO/2008/062650A1 |
A surface-treated stainless-steel sheet which is excellent in corrosion resistance under salt damage environments and in weld reliability and is for use as an automotive fuel tank or fuel pipe; and a surface-treated stainless-steel welde...
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WO/2008/056676A1 |
Disclosed is a lead-free solder paste composed of a solder powder and a flux (13) mixed with the solder powder. The solder powder is composed of a first base alloy powder (11) which is a first alloy in a powder form, and a second base al...
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WO/2008/043482A1 |
Disclosed is a lead-free soft solder based on an Sn-In-Ag solder alloy. Said soft solder contains 88 to 98.5 percent by weight of Sn, 1 to 10 percent by weight of In, 0.5 to 3.5 percent by weight of Ag, and 0 to 1 percent by weight of Cu...
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WO/2008/026761A1 |
A solder layer as a substitute for a high-temperature solder which bonds a functional-part package to a lid and has a solidus temperature of 250°C or higher. It is obtained by: applying a solder paste obtained by mixing a copper-based m...
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WO/2008/012729A2 |
The invention relates to a low-pressure mercury vapor discharge lamp provided with a discharge vessel (10; 210; 310) which encloses a discharge space (11; 211; 311) comprising a filling of mercury and a rare gas in a gastight manner. The...
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