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JP7428595B2 |
A semiconductor device includes: a semiconductor element; and a first conductor and a second conductor respectively joined to a first surface and a second surface of the semiconductor element via Sn-based solder, in which a Ni-based plat...
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JP7427657B2 |
A flux used for soldering with a tin-silver-copper alloy comprises an imidazole compound and/or an imidazoline compound; a dicarboxylic acid having 3 or more and 36 or less carbons; and a quaternary ammonium iodine salt. Relative to the ...
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JP2024013585A |
[Problem] It is possible to suppress void breakdown of solder. A semiconductor device includes an electronic component and a substrate arranged to face each other in a first direction, and a solder that connects the electronic component ...
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JP7421157B1 |
To provide a solder alloy, a solder paste, and a solder joint that exhibit a suitable melting temperature, excellent wettability, high tensile strength and shear strength, and further excellent drop impact resistance. The solder alloy ha...
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JP2024009991A |
A lead-free solder alloy for multi-level interconnects is provided. [Solution] 1~9 wt% Cu, at least one of the following: >0~1 wt% Ni, >0~10 wt% Ge, >0~1 wt% Mn, >0 ~ 10 wt% Al, >0~10 wt% Si, >0~9 wt% Bi, >0~5 wt% In, >0~1 wt% Ti, >0~2 w...
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JP7420363B2 |
To achieve improvement in electrical joint reliability in a solder joint with use of a lead-free solder alloy.Soldering of a By soldering a joining object (for example, copper plate) is performed with use of a lead-free solder alloy of S...
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JP7407733B2 |
The present invention addresses the problem of providing a flux sheet which exhibits strong adhesion to a substrate, while being free from displacement of a solder ball during a reflow process. In order to solve the above-described probl...
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JP7406069B2 |
A heat exchanger (1) includes: a first metal tube (20); a second metal tube (30); and a metallic joint (J) made of a joint material molten and then solidified to join the first metal tube (20) and the second metal tube (30) together. The...
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JP7406052B1 |
A solder alloy that has heat cycle resistance and drop impact resistance even when Bi is added, and can form a joint that suppresses the occurrence of lift-off. % to 0.65 mass% of Sb, 0.05 to 2 mass% of Ag, and 0.001 to 0.1 mass% of at l...
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JP7394257B1 |
The present invention provides metal particles that can overcome the brittleness of intermetallic compounds and maintain excellent bonding strength and mechanical strength even under severe temperature fluctuations in extremely high-temp...
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JP2023168270A |
To provide a graphene metal composite material having excellent dispersibility.A graphene-metal composite material is composed of a plurality of sheets of graphene and metal as main components, the plurality of sheets of graphene are dis...
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JP7381980B1 |
[Problems] It has excellent wettability and shear strength, has an appropriate fracture mode, suppresses the growth of intermetallic compounds at the bonding interface even after multiple reflows, and has excellent drop impact resistance...
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JP7376842B1 |
The present invention provides a solder alloy, a solder ball, a solder paste, and a solder joint that have excellent thermal conductivity, drop impact resistance, and heat cycle resistance. [Solution] The solder alloy contains Ag: 1.0~4....
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JP5138280B6 |
To provide a black material having superior blackness, heat resistance and light-shielding properties; a dispersion liquid of the black material, which has the black material dispersed in a dispersion medium; a black light-shielding film...
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JP7367631B2 |
A semiconductor device includes a semiconductor chip having first and second main electrodes disposed on opposite surfaces of a silicon carbide substrate, first and second heat dissipation members disposed so as to sandwich the semicondu...
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JP7367249B1 |
An object of the present invention is to provide an electrode for electrolytic plating, which provides contacts and terminal parts for electronic devices that have excellent durability when operating in high-temperature environments. [So...
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JP5336142B6 |
To provide an inexpensive solder alloy which has low Ag content and whose soldering property is enhanced. The solder alloy has a composition composed of, by weight, 0.1-0.4% Ag, 0.5-3.0% Cu, 0.5-1.0% In and the balance Sn with inevitable...
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JP7357227B2 |
A lead-free solder alloy includes Ag in an amount of 0.3 to 4.0% by mass, Cu in an amount of 0.1 to 2.0% by mass, Fe in an amount of 0.005 to 0.05% by mass, Ni in an amount of 0.01 to 0.5% by mass, Ga in an amount of 0.001 to 0.1% by mas...
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JP2023141365A |
To provide a lead-free solder alloy and a solder paste that have a resistance to instantaneous and concentrated force and good heat conductivity in addition to cooling/heating cycle characteristics and can be suitably used for also solde...
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JP2023139088A |
To provide a solder alloy having a lower melting point than that of conventional solder alloys, but with similar or more favorable mechanical and thermal properties.A solder alloy comprises: 40 to 65 wt.% bismuth; 1 to 10 wt.% indium; at...
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JP2023138947A |
To provide a conductive material that allows solder to be efficiently disposed on an electrode, and can effectively improve conduction reliability between vertical electrodes to be connected.A conductive material has a thermosetting comp...
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JP7354104B2 |
In the present invention, a high-purity metallic tin suitable for use in an EUV exposure device is provided through use of an oxidation-resistant metallic tin, the oxidation-resistant metallic tin containing 99.995 mass% or more of tin, ...
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JP2023130461A |
PURPOSE: To provide an inexpensive SnZn solder and a production method of an SnZn solder, the solder having resistance to a high temperature/low temperature repetition test and being extremely adamant to an electrode of a solar cell subs...
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JP7337822B2 |
The present invention provides a lead-free solder alloy comprising: 3.1 to 3.8 wt. % silver; 0.5 to 0.8 wt. % copper; 0.0 to 3.2 wt. % bismuth; 0.05 to 1.0 wt. % cobalt; 1.0 to 3.0 wt. % antimony; 0.005 to 0.02 wt. % titanium; and balanc...
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JP7335679B2 |
To provide a conductive material capable of maintaining excellent surface property under high temperature use.There is provided a conductive material having a base material consisting of a Cu-based material, a Cu-Sn intermetallic compoun...
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JP2023118674A |
To provide a flux composition which is excellent in cleanability of a flux residue by an aqueous cleaning agent, and is excellent in solder melting property in an atmosphere reflow.A flux composition contains (A) a rosin-based resin, (B)...
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JP7332458B2 |
To provide a conductive material capable of enhancing solder cohesiveness and storage stability.There is provided a conductive material which comprises a thermosetting component, a plurality of solder particles and a flux, wherein the fl...
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JP7323855B1 |
A solder alloy, a solder paste, a solder ball, a solder preform, a solder joint, and an in-vehicle product that has a liquidus temperature and a solidus temperature within a predetermined temperature range, excellent thermal conductivity...
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JP7323854B1 |
A solder alloy, a solder paste, a solder ball, a solder preform, a solder joint, and an in-vehicle product that has a liquidus temperature and a solidus temperature within a predetermined temperature range, excellent thermal conductivity...
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JP7323853B1 |
A solder alloy, a solder paste, a solder ball, a solder preform, a solder joint, and an in-vehicle product that has a liquidus temperature and a solidus temperature within a predetermined temperature range, excellent thermal conductivity...
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JP2023106062A |
To provide a technology capable of improving connection reliability of solder connection of a semiconductor device under a high temperature environment, and reducing poor wetting and spreading of solder.As solder for connecting a semicon...
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JP7312534B2 |
To provide a solder composition that can suppress bleeding in print and occurence of a solder bridge and suppress occurrence of chip standing, even in mounting a fine chip component in particular, and an electronic circuit-mounted substr...
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JP7301113B2 |
Undercooled liquid metallic core-shell particles, whose core is stable against solidification at ambient conditions, i.e. under near ambient temperature and pressure conditions, are used to join or repair metallic non-particulate compone...
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JP2023527861A |
A method of preparing powders of hard alloys, such as Ti and TiZr alloys, using a hydrodeoxidation process, and powders produced by this process are disclosed. Brazing powders can be produced using this method. This method is less hazard...
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JP2023088276A |
To provide a lead, copper and tin-free alloy.A lead, copper and tin-free alloy contains 0.01-3.0 wt.% silver, 0.01-5.0 wt.% bismuth, 0-2.0 wt.% antimony, 0.005-0.1 wt.% nickel, 0.005-0.02 wt.% germanium, and a surplus amount tin. The lea...
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JP7295157B2 |
To provide a flux composition and a solder composition which can suppress lowering of wettability occurrence of voids in solder joint.A flux composition contains (A) a rosin-based resin, (B) an activator and (C) a solvent, wherein (A) th...
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JP7291320B2 |
To provide a production method pf a solder joint where the highly reliable joint suppressed with volumetric change associated with phase transformation during operation even when performing plurality times of melting, cooling and solidif...
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JP2023524690A |
Some embodiments of the present invention relate to lead-free solder pastes having mixed solder powders that are particularly suitable for high temperature soldering applications involving multiple board level reflow operations. In one e...
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JP2023081279A |
To provide a solder alloy, a solder bonding material, a solder paste and a semiconductor package that are capable of inhibiting separation of a solder bonding portion from a semiconductor element at an interface therebetween.A solder all...
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JP2023081231A |
To provide solder alloy, a solder joint material, solder paste and a joint structure which can suppress a material to be jointed and a joint part from being improperly jointed.The solder alloy contains 1.1 mass% or more and 8 mass% or le...
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JP7289200B2 |
The present invention discloses a solder alloy, solder and a method for producing the same, and belongs to the field of solder. The solder alloy contains 0.9-4.1 wt % of silver, 0.3-1 wt % of copper, 0.02-0.085 wt % of rhodium, and the b...
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JP2023079242A |
PURPOSE: To provide a low-temperature solder, a method of manufacturing the low-temperature solder, and a low-temperature solder-coated lead wire, and in particular to provide an inexpensive low-temperature solder applicable to an electr...
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JP7287606B2 |
This lead-free solder alloy exhibits extremely favorable creep characteristics as a result of the added quantity of Cu being 0.1-2.0 mass%, the added quantity of Ni being 0.01-1.0 mass% and the added quantity of Ge being 0.001-2.0 mass%,...
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JP7287733B1 |
A method for manufacturing lead-free solder of surface diffusion hardening type is provided. The method comprises weighing raw materials at a set weight mixing ratio, placing tin in a steel container, placing the steel container in an in...
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JP7284699B2 |
To provide a conductive material capable of suppressing variations in a transfer area.There is provided a conductive material used for pin transfer and dip transfer which comprises a thermosetting component, a plurality of solder particl...
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JP7273818B2 |
A process for producing a solder product and a copper product from a first lead-tin based metal composition having at least 40% wt of copper and at least 5.0% wt together of tin and lead. The process includes the steps ofpartially oxidiz...
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JP7273049B2 |
A lead-free silver-free solder alloy may comprise tin, copper, bismuth, cobalt, and antimony. Alternatively, the alloy may comprise gallium in lieu of cobalt. The alloy may further comprise nickel, germanium, or both. The copper may be p...
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JP2023061626A |
To provide a solder joint material having a function for improving high frequency property; a solder joint material using the solder joint material; and an electronic component.An element and/or a material having Mohs hardness of 5.0 or ...
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JP2023060639A |
To provide a solder composition that is suitable for high-density mounting, and to provide an electronic component.A solder composition includes Sn. The composition includes 1.0-5.0 mass% Cu, 0.1-0.5 mass% Ni, and more than 0.01 mass% an...
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JP7262695B1 |
A solder alloy containing Bi and capable of forming a joint that has heat cycle resistance, drop impact resistance, and suppresses the occurrence of lift-off, comprising 35% by mass or more and 65% by mass or less of Bi, and 0.1% by mass...
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