Title:
はんだ継手
Document Type and Number:
Japanese Patent JP7420363
Kind Code:
B2
Abstract:
To achieve improvement in electrical joint reliability in a solder joint with use of a lead-free solder alloy.SOLUTION: Soldering of a By soldering a joining object (for example, copper plate) is performed with use of a lead-free solder alloy of Sn Cu Ni Bi Ge. Thus, even if high temperature aging occurs, it is suppressed that an electric resistivity is increased at a junction between the joining object and a solder part of the solder alloy, and it is prevented that electric conductivity at the joint is reduced.SELECTED DRAWING: Figure 6
Inventors:
Tetsuro Nishimura
Takatoshi Nishimura
Tetsuya Akaiwa
Shoichi Suenaga
Takatoshi Nishimura
Tetsuya Akaiwa
Shoichi Suenaga
Application Number:
JP2019041026A
Publication Date:
January 23, 2024
Filing Date:
March 06, 2019
Export Citation:
Assignee:
Nippon Superior Co., Ltd.
International Classes:
B23K35/26; C22C13/00; C22C13/02
Domestic Patent References:
| JP6119912B1 | ||||
| JP6119911B1 | ||||
| JP2018023987A | ||||
| JP61092797A | ||||
| JP1262092A | ||||
| JP2000190090A | ||||
| JP2014097532A | ||||
| JP5872114B1 |
Attorney, Agent or Firm:
Hidehito Kono
Norio Kawano
Norio Kawano