Title:
SOLDER ALLOY, SOLDER JOINT MATERIAL, SOLDER PASTE AND JOINT STRUCTURE
Document Type and Number:
Japanese Patent JP2023081231
Kind Code:
A
Abstract:
To provide solder alloy, a solder joint material, solder paste and a joint structure which can suppress a material to be jointed and a joint part from being improperly jointed.SOLUTION: The solder alloy contains 1.1 mass% or more and 8 mass% or less of Cu, 6 mass% or more and 20 mass% or less of Sb, 0.01 mass% or more and 0.8 mass% or less of Ni and 0.001 mass% or more and 1 mass% or less of Co, and the other parts made of Sn.SELECTED DRAWING: Figure 1
Inventors:
NARUSE SHOICHIRO
NAKANO KEN
SAKAMOTO ISAO
SHIMADA TOSHIAKI
OKUBO KOICHI
NAKANO KEN
SAKAMOTO ISAO
SHIMADA TOSHIAKI
OKUBO KOICHI
Application Number:
JP2021195006A
Publication Date:
June 09, 2023
Filing Date:
November 30, 2021
Export Citation:
Assignee:
TAMURA SEISAKUSHO KK
International Classes:
B23K35/26; B23K35/22; C22C13/02
Attorney, Agent or Firm:
Youko Ohta