Title:
BONDING PORTION, ELECTRONIC CIRCUIT BOARD, AND SEMICONDUCTOR PACKAGE
Document Type and Number:
Japanese Patent JP2023081279
Kind Code:
A
Abstract:
To provide a solder alloy, a solder bonding material, a solder paste and a semiconductor package that are capable of inhibiting separation of a solder bonding portion from a semiconductor element at an interface therebetween.SOLUTION: A solder alloy contains: 1.1 mass% or more and 8 mass% or less of Cu; 6 mass% or more and 20 mass% or less of Sb; 0.01 mass% or more and 0.5 mass% or less of Ni; and 0.001 mass% or more and 1 mass% or less of Co; with the balance being Sn.SELECTED DRAWING: Figure 1
More Like This:
Inventors:
NARUSE SHOICHIRO
NAKANO KEN
SAKAMOTO ISAO
SHIMADA TOSHIAKI
OKUBO KOICHI
NAKANO KEN
SAKAMOTO ISAO
SHIMADA TOSHIAKI
OKUBO KOICHI
Application Number:
JP2022132865A
Publication Date:
June 09, 2023
Filing Date:
August 23, 2022
Export Citation:
Assignee:
TAMURA SEISAKUSHO KK
International Classes:
B23K35/26; B23K35/363; C22C13/02; H05K3/34
Attorney, Agent or Firm:
Youko Ohta