Title:
JOINT MATERIAL
Document Type and Number:
Japanese Patent JP2023061626
Kind Code:
A
Abstract:
To provide a solder joint material having a function for improving high frequency property; a solder joint material using the solder joint material; and an electronic component.SOLUTION: An element and/or a material having Mohs hardness of 5.0 or more such as germanium, silicon carbide and alumina are allowed to contain into a solder alloy such as Sn, Sn-Cu alloy, Sn-Cu-Ag alloy, Sn-Cu-Ni-based alloy and Sn-Bi-based alloy, and thereby skin effect of a current flowing in a solder joint part is heightened, and high frequency property can be improved.SELECTED DRAWING: None
Inventors:
NISHIMURA TETSURO
Application Number:
JP2021171667A
Publication Date:
May 02, 2023
Filing Date:
October 20, 2021
Export Citation:
Assignee:
NIHON SUPERIOR CO LTD
International Classes:
B23K35/26; B23K35/14; B23K35/28; C22C12/00; C22C13/00; C22C18/00