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WO/2008/014157A2 |
An electrical component includes a conductive substrate (18), a tin layer (19) formed on the substrate, and a coating (22) of a foam formed on the tin layer to impede tin whisker growth, the coating comprising a foam (28) having voids (3...
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WO/2008/013104A1 |
An SnCu-based lead-free solder alloy which eliminates a drawback that an intermetallic compound excessively precipitates and the precipitate serves as nuclei to form dross to thereby cause soldering defects including horning. It satisfie...
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WO/2008/007404A2 |
It is described a method for releasing mercury in devices requiring it, in particular fluorescent lamps, based on the use of manganese-mercury compositions.
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WO/2008/004531A2 |
A cream solder obtained by kneading an Sn-Ag-Cu alloy together with a flux, wherein the Sn-Ag-Cu alloy comprises a mixture of a first powdery alloy and a second powdery alloy, the first powdery alloy is represented by an Sn-Ag phase diag...
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WO/2008/004428A1 |
Provided is an alloy for easily and safely generating hydrogen for a long time. A first metal, which is composed of one or more kinds of metals of Al, Zn and Mg, and a second metal composed of one or more kinds of metals of Ga, Cd, In, S...
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WO/2007/102588A1 |
Disclosed is a lead-free solder alloy exhibiting good performance in impact resistance and vibration resistance. Also disclosed are a solder ball using such a lead-free solder alloy, and an electronic member having a solder bump using su...
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WO/2007/102589A1 |
Disclosed is a lead-free solder alloy excellent in impact resistance and vibration resistance. Also disclosed are a solder ball using such a lead-free solder alloy, and an electronic member having a solder bump using such a lead-free sol...
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WO/2007/099820A1 |
This invention provides a precursor for the manufacture of an Nb3Sn superconducting wire rod. The precursor comprises a superconducting core part comprising a Cu-Sn-base alloy and a plurality of Nb-base filaments disposed in the Cu-Sn-ba...
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WO/2007/082459A1 |
The invention relates to a lead-free solder and a preparing method thereof. The solder comprises 0.1 -5.0 wt% Cu 0.001 -0.5 wt% Ni, 0.0001 -0.1 wt% P or Ga and a balance of Sn. According to the present invention, raw materials with high ...
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WO/2007/079671A1 |
The invention relates to lead-free solder and a preparing method thereof. The solder comprises 0.1 -4.0 wt% Cu 0.001 -0.5 wt% Ni 0.1 -6.0 wt% Ag 0.0001 -0.1 wt% P or Ga and a balance of Sn. According to the present invention, raw materia...
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WO/2007/081006A1 |
Disclosed is a Pb-free solder alloy consisting of, in mass%, 0.1-1.5% of Ag, 0.5-0.75% of Cu, Ni in an amount satisfying 12.5 ≤ Cu/Ni ≤ 100, and the balance of Sn and unavoidable impurities. The solder alloy preferably contains, in m...
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WO/2007/081775A2 |
Lead-free solder compositions suitable for joining electronic devices to printed wiring boards, which comprises by weight 0.2 to 0.9 % copper, 0.006 to 0.07 % nickel, 0.03 to 0.08 % bismuth, less than 0.5 % silver, less than 0.010 % phos...
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WO/2007/068503A2 |
The invention relates to an Sn-containing heavy-duty material composition for coating base metals. Said material composition comprises: 0.6 to 91 wt. % of Sn; 75 to 94 wt. % of Al; 0.7 to 82 wt. % of Cu; 0 to 27 wt. % of Pb; 6 to 30 wt. ...
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WO/2007/070548A2 |
Lead- free solder alloys and solder joints thereof with improved drop impact resistance are disclosed. In one particular exemplary embodiment, the lead-free solder alloys preferably comprise 0.0-4.0 wt . % of Ag, 0.01-1.5 wt . % of Cu, a...
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WO/2007/049025A1 |
An alloy suitable for use in tinning or the manufacture of heat exchangers, the alloy comprising: from 2 - 6 wt.% copper, from 0.08 - 1.5 wt.% bismuth, from 0 - 1.5 wt.% silver, from 0 - 0.02 wt.% phosphorus, from 0 - 0.02 wt.% germanium...
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WO/2007/050571A2 |
A technique for technique for increasing the compliance of lead-free solders containing silver is disclosed. In one particular exemplary embodiment, the technique may be realized as a Sn-Ag-Al alloy composition comprising (0.01-20) %Ag, ...
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WO/2007/045191A2 |
The present invention relates to a lead-free solder alloy on base of alloy from a group alloy comprising of an alloy of bismuth and tin, an alloy of copper, nickel and tin, and an alloy of copper, silver and tin, containing 0.005 to 1 wt...
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WO/2007/046390A1 |
This invention provides a recording layer for an optical information recording medium that is excellent, for example, in initial reflectance and recording mark moldability, as well as in durability under a high temperature and high humid...
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WO/2007/038490A2 |
Low melting temperature compliant solders are disclosed. In one particular exemplary embodiment, a low melting temperature compliant solder alloy comprises from about 91.5% to about 97.998% by weight tin, from about 0.001% to about 3.5% ...
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WO/2007/027428A2 |
A technique for increasing the compliance of tin-indium solders is disclosed. In one particular exemplary embodiment, the technique may be realized as a lead free solder alloy comprising from about 58.0% to about 99.998% by weight tin, f...
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WO/2007/023284A1 |
A method of forming a solder joint, comprising: (a) providing a lead-free, tin-containing solder alloy; (b) providing a printed wiring board substrate or a ball grid array substrate, said substrate being formed from a material comprising...
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WO/2007/015910A1 |
Alloy compositions are described for use in anodes of lithium ion batteries. The alloy compositions contain (a) tin, (b) a second element that includes silicon, aluminum, or a combination thereof, (c) a third element that includes yttriu...
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WO/2007/014529A1 |
A low melting point lead-free solder alloy which relates to the field of electronic materials and electronic manufacture technology, is composed of (in wt%): Zn: 4~12, Ag: 0~2.5, Bi: 0.5~2.5, In: 0~5.0, P: 0.005~0.02, and balance Sn. The...
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WO/2007/014530A1 |
A lead-free Sn-Ag-Cu-Ni-Al system solder alloy which relates to the field of electronic materials and electronic manufacture technology, is composed of (in wt%): Ag 1.5~4.0, Cu 0.1~2.0, Al 0.001~0.5, Ni: 0.01~1.0, balance Sn and inevitab...
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WO/2007/010927A1 |
A solder free from lead for additional supply to control the Cu concentration and Ni concentration in solder bath which sharply vary depending upon the particularity of post-process; and a method of regulating the Cu concentration and Ni...
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WO/2007/007840A1 |
Disclosed is a lead-free metal solder material which enables to attain excellent bonding strength and hermetic sealing. Specifically disclosed is a solder alloy for oxide bonding which is composed of, in mass%, 2.0-15.0% of Ag, more than...
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WO/2007/004394A1 |
A high-purity tin or tin alloy characterized in that the respective contents of U and Th are simultaneously 5 ppb or less and the respective contents of Pb and Bi simultaneously 1 ppm or less, and that the purity thereof is 5 N or higher...
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WO/2007/001598A2 |
A package substrate (4) includes die solder pads (3) and pin solder fillets (5). The pin solder fillets (5) might comprise between approximately 90 wt % to approximately 99 wt % tin and approximately 10 wt % to 1 wt % antimony. The die s...
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WO/2006/129713A1 |
Disclosed is a lead-free solder alloy exhibiting improved drop impact resistance even after thermal aging while being good in soldering properties, void formation and discoloration. Specifically disclosed is a solder alloy consisting ess...
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WO/2006/122240A2 |
A lead-free and bismuth-free solder alloy composition for electronic assembly applications having reduced toxicity. The alloy composition comprises about 0.01% to about 4.5% silver; about 0.01% to about 3% copper; about 0.002% to about 5...
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WO/2006/118183A1 |
Disclosed is a tin powder-containing colloidal liquid including no other metal such as chromium while exhibiting a certain dispersibility. This tin powder-containing colloidal liquid enables to obtain an ultrafine tin powder. Also disclo...
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WO/2006/088690A2 |
A method (80) of reducing stress between substrates of differing materials includes the steps of applying (82) solder (16) on a first substrate (14), reflowing (84) the solder on the first substrate to form a cladded substrate (30), appl...
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WO/2006/080289A1 |
This invention provides electrically conductive fine particles and an anisotropic electrically conductive material using the electrically conductive fine particles that, even when used particularly in a plasma display panel, have low con...
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WO/2006/077826A1 |
A bearing of a motor driven fuel pump which comprises a Cu-Ni based sintered alloy having a chemical composition that Ni: 21 to 35 %, Sn: 5 to 12 %, C: 3 to 7 %, P: 0.1 to 0.8 % and the balance: Cu and inevitable impurities, wherein pore...
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WO/2006/070797A1 |
A lead-free solder flux which can reduce generation of bubble voids and cavity voids without deteriorating normal soldering characteristics of solder balls and the like. The lead-free solder flux contains a polyhydric alcohol ester (a1) ...
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WO/2006/064880A1 |
An image display device having two substrates (11, 12) oppositely disposed with an interval and a vacuum seal section (31) for sealingly joining the substrates at predetermined positions and defining a closed space between the substrates...
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WO/2006/059115A1 |
An alloy suitable for use in a wave solder process, reflow soldering process, hot air levelling process or a ball grid array, the alloy comprising from 0.08 - 3 wt.% bismuth, from 0.15 - 1.5 wt.% copper, from 0.1 - 1.5 wt.% silver, from ...
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WO/2006/055259A2 |
A lead-free solder alloy includes a tin-copper alloy that also includes a minor amount of cobalt, which has been found to provide a shiny and reflective appearance to the solder alloy. Methods of soldering using such an alloy, as well as...
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WO/2006/049024A1 |
[PROBLEMS] Recently, a lead-free solder containing Sn as a main component has been frequently used from the view point of regulatory constrains to Pb. The lead-free solder has a liquidus line temperature near 220&ring C, and therefore, w...
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WO/2006/040582A1 |
A solder alloy for use in the manufacture of electrical fuses, the alloy comprising: Copper - from 0.5 to 4 wt.% Silver - from 0.1 to 1 wt.% Antimony - from 0.2 to 3 wt.% Bismuth - from 0 to 1.5 wt.% Zinc - from 0 to 2 wt.% Nickel - from...
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WO/2006/038907A2 |
A lead-free solder composition (12) for soldering onto a substrate includes a solder having tin and silver; and additive (14) having a low coefficient of thermal expansion.
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WO/2006/033304A1 |
Disclosed is a black material composed of particles mainly containing an Ag-Sn alloy which includes not less than 47.6% and not more than 90% by weight of Ag, and this black material is characterized in that the particles have an average...
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WO/2006/028668A1 |
It is provided an apparatus comprising conductive contacts on a surface's die and a substrate coupled to at least one of said contracts by a lead-free Tin-Indium solder, in particular a solder comprising about 82 to 88 %wt Tin and about ...
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WO/2006/027403A1 |
The invention relates to an ODS (oxide-dispersion-strengthened or particulate dispersion) type of material comprising a metal alloy matrix containing a dispersion of distributed reinforcement particles which impart optimal density and de...
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WO/2006/008842A1 |
Conventional sliding materials compounded with Bi have occasionally experienced burn-in at sliding parts that make high-speed rotation. It is intended to provide a sliding material free from any burn-in at sliding parts that make high-sp...
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WO/2005/102594A1 |
Disclosed is an Sn-Zn alloy solder having a chemical composition comprising Zn: 7-10 mass%, Ag: 0.075-1 mass%, Al: 0.07-0.5 mass%, one or both of Bi: 0.01-6 mass% and Cu: 0.007-0.1 mass%, if necessary Mg: 0.007-0.1 mass%, and the balance...
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WO/2005/098979A1 |
The present invention provides a thermoelectric material made from the ZrNiSn-based, half-Heusler structure where Pd is alloyed on the site of Ni, Hf alloyed on Zr, and Sb doped on Sri, all in accordance with the formula Zro.5Hfo.5Nii-XP...
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WO/2005/098931A1 |
A submount structure for simply controlling wettability of an Sn-Zn based solder formed on a metallized layer. Of the metallized layer, a surface of a region adjacent to a region directly under an Sn-An based solder is formed of an Au-Zn...
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WO/2005/090622A1 |
A lead free solder composition is disclosed which comprises copper, magnesium and silver in a tin matrix. The solder composition has a melting temperature of less than 215 C and preferably less than 200 C.
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WO/2005/077583A1 |
Disclosed is a method enabling soldering with good quality. The pressure in a vacuum chamber (2), wherein an object (10) with a solid solder containing tin only or tin and one or more components selected from silver, lead, copper, bismut...
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