| Document |
Document Title |
|
WO/2016/012754A2 |
A lead-free, antimony-free solder alloy comprising: (a) from 1 to 4 wt.% silver (b) from 0.5 to 6 wt.% bismuth (c) from 3.55 to 15 wt.% indium (d) 3 wt.% or less of copper (e) optionally one or more of the following elements 0 to 1 wt.% ...
|
|
WO/2016/002770A1 |
Provided are: a soft metal wire having improved characteristics so as to have a low yield stress and a large breaking elongation value; an interconnector for a solar cell collector; a solar cell module; and a method for manufacturing a m...
|
|
WO/2015/198496A1 |
This solder alloy is a tin-silver-copper system alloy which is substantially composed of tin, silver, copper, bismuth, nickel, cobalt and indium. Relative to the total amount of this solder alloy, the content ratio of silver is from 2% b...
|
|
WO/2015/198497A1 |
A solder alloy which is substantially composed of tin, silver, indium, bismuth and antimony, and wherein, relative to the total amount of the solder alloy, the content ratio of silver is set to a value from 2.8% by mass to 4% by mass (in...
|
|
WO/2015/166945A1 |
The purpose of the present invention is to provide a lead-free solder alloy and solder in which it is possible to maintain high junction strength that does not decrease even in a high temperature state after soldering, the lead-free sold...
|
|
WO/2015/163232A1 |
This process is a process for producing a united object that comprises a ceramic member constituted of a ceramic and a Cu member united thereto which is constituted of Cu or a Cu alloy, the process comprising: a superposition step in whi...
|
|
WO/2015/152387A1 |
Provided is a solder alloy having a composition suitable for soldering a module obtained by joining an aluminum substrate to a component wherein a main body, in which the area of an electrode on a side surface is not more than 30% of the...
|
|
WO/2015/146473A1 |
Provided is a flux which can remove a metal oxide to improve solder wettability, and of which a residue that remains on an object to be bonded with a solder can secure the object. The flux comprises a heat-curable resin and a long-chain ...
|
|
WO/2015/137338A1 |
This negative electrode (12) for an electricity-storage device comprises a collector (18) and a large number of particles (22) anchored to surfaces of said collector (18). Said particles (22) comprise a silicon-based alloy. The alloy con...
|
|
WO/2015/129840A1 |
Provided is a glass for an automotive vehicle capable of preventing cracking in glass substrate for an automotive vehicle over time when one surface of a metal terminal is soldered to a silver electrode formed on the glass substrate usin...
|
|
WO/2015/125855A1 |
Provided is a lead-free solder alloy or the like, which contains more than 3.0 mass % but not more than 10 mass % of Sb, with the balance consisting of Sn.
|
|
WO/2015/125331A1 |
Provided is a low α-emitting bismuth, characterized in that the α ray emission rate is 0.003 cph/cm2 or less. Provided is a method for producing a low α-emitting bismuth, characterized in that bismuth having an α ray emission rate of...
|
|
WO/2015/115483A1 |
Provided is a flux composition for solders, which is thermally cured so as to cover and reinforce a solder ball during solder ball bonding. Used is a flux for soldering, which contains an epoxy resin, an organic carboxylic acid containin...
|
|
WO/2015/113092A1 |
The invention relates to a sliding bearing (1) comprising a supporting layer (2) and an antifriction layer (3) which is arranged on the supporting layer (2) and is connected to same, the antifriction layer (3) consisting of a tin based a...
|
|
WO/2015/111587A1 |
The purpose of the present invention is to provide a solar-cell interconnector capable of suppressing internal breakage and detachment from a solar cell caused by thermal-stress concentration; and a solar cell module. The present inventi...
|
|
WO/2015/092901A1 |
The present invention provides: an electrode connection set comprising an electrode composition and a connection material containing an adhesive; a solar cell manufacturing method for manufacturing a solar cell using said electrode set; ...
|
|
WO/2015/075788A1 |
A semiconductor device (20) which comprises: a semiconductor chip (1); a member to be connected (5) which is connected to the semiconductor chip (1) with a solder alloy (lead-free solder alloy) (2) being interposed therebetween; and an e...
|
|
WO/2015/068685A1 |
Provided are a Cu core ball and a Cu core column making it possible to obtain drop strength and strength in relation to heat cycle. The Cu core ball (1) is provided with: a Cu ball (2) configured from Cu or a Cu alloy; and a solder layer...
|
|
WO/2015/066155A1 |
A lead- free, silver-free solder alloy includes 0.001 to 0.800 % by weight copper, 0.080 to 0.120 % by weight bismuth, 0.030 to 0.050 % by weight nickel, 0.008 to 0.012 % by weight phosphorus, and balance tin, together with unavoidable i...
|
|
WO/2015/064595A1 |
The present invention provides the following: a tin alloy float bath, device for manufacturing float glass, and method of manufacturing float glass that make it possible to provide high-quality float glass for which defects caused by the...
|
|
WO/2015/053114A1 |
The purpose of the present invention is to inhibit the formation of Cu3SnIMC in a lead-free, low-melting, Sn-Cu based brazing filler metal and thereby provide a low-melting brazing filler metal which can attain improved joint reliability...
|
|
WO/2015/040714A1 |
Provided is an Ni ball that has a low α-ray amount, even though containing a definite amount or more of impurity elements other than Ni, and has a high sphericity. An Ni ball wherein: the U content is controlled to 5 ppb or less; the Th...
|
|
WO/2015/037279A1 |
A lead-free solder characterized by comprising 1.2-4.5 mass% Ag, 0.25-0.75 mass% Cu, 1-5.8 mass% Bi, 0.01-0.15 mass% Ni, and Sn as the remainder. Due to the addition amounts, not only thermal fatigue resistance but also general solder pr...
|
|
WO/2015/019966A1 |
This lead-free solder alloy which contains, in mass%, 31-59% of Bi, 0.15-0.75% of Sb, and 0.3-1.0% of Cu and/or 0.002-0.055% of P with the balance essentially made up of Sn has a low melting point that enables suppression of a strain in ...
|
|
WO/2015/019967A1 |
This lead-free solder alloy, which is capable of forming a solder joint that is suppressed in electromigration during the time when an electric current is passed through at a high current density and is suppressed in increase of the resi...
|
|
WO/2015/011680A1 |
The present disclosure relates to a method of synthesizing intermetallic nanoparticle with a crystal structure of NiAs type, wherein said method is a modified polyol method. The disclosure particularly discloses NiSb, CoSb, NiPb PdSb and...
|
|
WO/2015/001817A1 |
Provided are an electromagnetic wave shield-use metal foil, electromagnetic wave shield material, and a shield cable which are superior in resistance to corrosion, and which are of low cost. [Problem] On one surface or both surfaces of a...
|
|
WO/2014/208176A1 |
The purpose of the present invention is to provide, at a low price, a metal porous body usable for the electrode of a fuel cell, etc., as well as having exceptional corrosion resistance. The present invention provides a sheet-shaped meta...
|
|
WO/2014/207897A1 |
The purpose of the present invention is to provide a solder material in which the amount of radiated α-rays can be reduced. A solder ball (1A), which is a solder material, is provided with a nuclei layer (2A) having sufficient diameter ...
|
|
WO/2014/203594A1 |
Provided is a porous metal body that excels in corrosion resistance in comparison to conventional porous metal bodies comprising nickel-tin binary alloys or nickel-chromium binary alloys. The porous metal body has a three-dimensional mes...
|
|
WO/2014/203348A1 |
Provided is a Cu core ball that is capable of suppressing soft errors and thus reducing connection failures. The Cu core ball is provided with a solder plating film that is formed on the surface of a Cu ball, wherein: the solder plating ...
|
|
WO/2014/192521A1 |
Provided are: a solder ball which is capable of achieving excellent thermal fatigue characteristics and good drop impact resistance characteristics, while suppressing generation of voids in a joined part; and an electronic member which u...
|
|
WO/2014/181883A1 |
A solder joint layer has a structure in which a plurality of fine granular second crystal parts (22) are deposited at a crystal grain boundary between first crystal parts (21) dispersed in a matrix. The first crystal part (21) is a plura...
|
|
WO/2014/169890A1 |
A tin-based sliding bearing alloy contains zinc as its principal alloying element at a content of 2 to 14 % w/w and has the Sn-Zn eutectic as its main structural element. The content of zinc as the principal alloying element can be expan...
|
|
WO/2014/170994A1 |
Provided is an Sn-Bi-Cu-Ni lead-free solder alloy which has a low melting point, excellent ductility and high tensile strength, while having a high shear strength by suppressing the generation of a P-rich layer at the bonding interface a...
|
|
WO/2014/170963A1 |
Provided is a lead-free solder ball that has excellent optical inspection properties and has a solder ball surface in a uniformly matted state without showing any irregularity caused by the growth of dendrites on the solder ball surface....
|
|
WO/2014/168027A1 |
A solder paste whereby metal does not flow out of a joint during a second or subsequent reflow heating stage. Said solder paste exhibits high joint strength at room temperature and at high temperatures, excels in terms of temporal stabil...
|
|
WO/2014/168026A1 |
A solder paste whereby metal does not flow out of a joint during a second or subsequent reflow heating stage. Said solder paste excels in terms of temporal stability and exhibits high joint strength at room temperature and at high temper...
|
|
WO/2014/163167A1 |
With the increasing density of in-vehicle electronic circuits, not only conventional cracks at bonding interfaces such as between the substrate and the solder attachment site or a component and the solder attachment site but also novel c...
|
|
WO/2014/157178A1 |
The present invention is a power module which is provided with: a substrate for power modules, which is obtained by providing a circuit layer (12) on one surface of an insulating layer; and a semiconductor element (3) which is bonded ont...
|
|
WO/2014/142153A1 |
An Ag electrode joint having a high joint strength can be obtained by actively minimizing the particle size of an Ag-Zn intermetallic compound at the solidification point. A joint obtained by joining an article to be joined, which compri...
|
|
WO/2014/129258A1 |
A solder composition containing Sn and Ge, the content of both Sb and Bi being less than 0.003 wt%.
|
|
WO/2014/115695A1 |
An Sn-Ag-Cu-based solder powder is obtained by depositing, as an additive agent, on surfaces of a solder powder having an average particle size of not more than 5 µm, a dry substance of a solution of hydroxybenzoic acid having a melting...
|
|
WO/2014/114225A1 |
A Pb-free solder alloy contains 4-12 wt% of Zn, 0.5-4 wt% of Bi, 0.5-5 wt% of In, 0.005-0.5 wt% of P, 0.001-0.5 wt% of Zr and at least one selected from a group consisting of: 0-0.1 wt% of Y, 0-0.2 wt% of Ge, 0-0.05 wt% of Mg, 0-0.02 wt%...
|
|
WO/2014/103934A1 |
This power module has: a copper layer comprising copper or a copper alloy, provided on a circuit layer (12) surface bonded to a semiconductor element (3); and a soldered layer (20) formed by using a solder material and formed between the...
|
|
WO/2014/103955A1 |
This power module has: a copper layer comprising copper or a copper alloy, provided on a circuit layer (12) surface bonded to a semiconductor element (3); and a soldered layer (20) formed by using a solder material and formed between the...
|
|
WO/2014/103916A1 |
Provided is a fuse element capable of providing effective protection even in the case of excess current that does not significantly exceed the rated current, for example, excess current that is about 1.2-2 times the rated capacity. In a ...
|
|
WO/2014/097390A1 |
Provided is a lead-free solder alloy that has excellent tensile strength and ductility, does not deform after heat cycles, and does not crack. The In and Bi content are optimized and the Sb and Ni content are adjusted. As a result, this ...
|
|
WO/2014/084242A1 |
The present invention provides a brazing material which has a low melting point and is easy to use. A low melting point brazing material of the present invention is formed from 0.3-41.4% by weight of Cu, 0.04-2% by weight of Ni and the b...
|
|
WO/2014/084080A1 |
When a package having an electrode to which Ni/Au plating or Ag/Pd alloy plating has been applied is bonded by soldering to a printed substrate having a Cu electrode or an electrode to which Cu plating has been applied, a layered solder ...
|
