Title:
SOLDER ALLOY, SOLDER COMPOSITION, SOLDER PASTE AND ELECTRONIC CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2015/198496
Kind Code:
A1
Abstract:
This solder alloy is a tin-silver-copper system alloy which is substantially composed of tin, silver, copper, bismuth, nickel, cobalt and indium. Relative to the total amount of this solder alloy, the content ratio of silver is from 2% by mass to 5% by mass (inclusive), the content ratio of copper is from 0.1% by mass to 1% by mass (inclusive), the content ratio of bismuth is from 0.5% by mass to 4.8% by mass (inclusive), the content ratio of nickel is from 0.01% by mass to 0.15% by mass (inclusive), the content ratio of cobalt is from 0.001% by mass to 0.008% by mass (inclusive), the content ratio of indium is more than 6.2% by mass but 10% by mass or less, and the content ratio of tin is the balance.
Inventors:
IKEDA KAZUKI (JP)
INOUE KOSUKE (JP)
ICHIKAWA KAZUYA (JP)
TAKEMOTO TADASHI (JP)
INOUE KOSUKE (JP)
ICHIKAWA KAZUYA (JP)
TAKEMOTO TADASHI (JP)
Application Number:
PCT/JP2014/072575
Publication Date:
December 30, 2015
Filing Date:
August 28, 2014
Export Citation:
Assignee:
HARIMA CHEMICALS INC (JP)
International Classes:
C22C13/00; B23K35/26; H05K3/34
Domestic Patent References:
| WO2014013632A1 | 2014-01-23 | |||
| WO2009011392A1 | 2009-01-22 |
Foreign References:
| JP2013193092A | 2013-09-30 | |||
| JP2012106280A | 2012-06-07 | |||
| JP2008521619A | 2008-06-26 | |||
| JP5349703B1 | 2013-11-20 |
Other References:
See also references of EP 2979807A4
Attorney, Agent or Firm:
OKAMOTO, Hiroyuki et al. (JP)
Hiroyuki Okamoto (JP)
Hiroyuki Okamoto (JP)
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