Title:
SOLDER ALLOY, SOLDER PASTE AND ELECTRONIC CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2015/198497
Kind Code:
A1
Abstract:
A solder alloy which is substantially composed of tin, silver, indium, bismuth and antimony, and wherein, relative to the total amount of the solder alloy, the content ratio of silver is set to a value from 2.8% by mass to 4% by mass (inclusive), the content ratio of indium is set to a value from 6.2% by mass to 9.0% by mass (inclusive), the content ratio of bismuth is set to a value from 0.7% by mass to 5.0% by mass (inclusive), the content ratio of antimony is set to a value from 0.3% by mass to 5.0% by mass (inclusive), and the content ratio of tin is set to the balance, so that the value A of discriminant (1) is 4.36 or less.
A = 0.87 × [In content ratio (mass%)] - 0.41 × [Ag content ratio (mass%)] - 0.82 × [Sb content ratio (mass%)] (1)
Inventors:
IKEDA KAZUKI (JP)
INOUE KOSUKE (JP)
ICHIKAWA KAZUYA (JP)
TAKEMOTO TADASHI (JP)
INOUE KOSUKE (JP)
ICHIKAWA KAZUYA (JP)
TAKEMOTO TADASHI (JP)
Application Number:
PCT/JP2014/072576
Publication Date:
December 30, 2015
Filing Date:
August 28, 2014
Export Citation:
Assignee:
HARIMA CHEMICALS INC (JP)
International Classes:
B23K35/26; C22C13/00; H05K3/34
Domestic Patent References:
| WO2012127642A1 | 2012-09-27 | |||
| WO2002040213A1 | 2002-05-23 | |||
| WO2014013847A1 | 2014-01-23 | |||
| WO2010122764A1 | 2010-10-28 |
Foreign References:
| JPH0970687A | 1997-03-18 | |||
| JP2004188453A | 2004-07-08 | |||
| JP2004188453A | 2004-07-08 |
Other References:
See also references of EP 3093098A4
Attorney, Agent or Firm:
OKAMOTO, Hiroyuki et al. (JP)
Hiroyuki Okamoto (JP)
Hiroyuki Okamoto (JP)
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