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WO/2021/160196A1 |
The invention relates to a lead-free soldering foil, for connecting metal and/or metal-coated components. The problem addressed by the invention is that of developing a lead-free soldering foil which allows the setting of a defined conne...
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WO/2021/161953A1 |
Provided are a lead-free and antimony-free solder alloy, a solder ball, and a solder joint capable of suppressing fusion failure as a result of having improved shear strength, which is attributed to the refinement of crystal grains at ju...
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WO/2021/153550A1 |
This thermoelectric conversion module is formed by electrically connecting, by a conductive member, one end of an n-type thermoelectric conversion element having a negative Seebeck coefficient and having a half-Heusler structure to one e...
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WO/2021/140370A1 |
Provided in the present invention is a solder, comprising: a first alloy powder in an amount between 90% to 99.99% by weight, the powder comprising a first alloy having a solidus temperature between 170 degrees Celsius and 250 degrees Ce...
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WO/2021/100295A1 |
The present invention provides: a conductive body having a conductivity higher than that of conventional conductive bodies made of silver; and a conductive film-provided substrate on which a conductive film is formed. This conductive b...
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WO/2021/079702A1 |
A core material that has: a core 12; a solder layer 16 comprising an (Sn–Bi) solder alloy and provided on the outside of the core 12; and an Sn layer 20 provided on the outside of the solder layer 16. The core includes metal or a resin...
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WO/2021/065271A1 |
The present invention relates to a flux including rosin, an active agent, a solvent, and a thixotropic agent containing polyethyleneglycol, wherein the polyethyleneglycol content is 10 to 20% by mass with respect to the total mass of the...
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WO/2021/060103A1 |
A heat exchanger (1) is provided with a first metal tube (20), second metal tubes (30), and metal joint portions (J) which are formed through solidification of a melted joining material and which join the first metal tube (20) and the se...
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WO/2021/054197A1 |
The present invention provides an adhesive which is capable of maintaining the bonding strength between substrates even if heated repeatedly, while being capable of controlling the gap of an air cavity with high accuracy. An adhesive a...
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WO/2021/054195A1 |
The present invention provides an adhesive for air cavity formation, said adhesive being capable of controlling the gap of an air cavity with high accuracy. An adhesive for air cavity formation according to the present invention is use...
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WO/2021/054194A1 |
Provided is an adhesive capable of controlling the gap of an air cavity with high accuracy even when repeatedly heated. The adhesive according to the present invention is for bonding metals in a first substrate having a first metal por...
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WO/2021/054196A1 |
The present invention provides an adhesive which is capable of maintaining the bonding strength between substrates even if heated repeatedly, while being capable of controlling the gap of an air cavity with high accuracy. An adhesive a...
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WO/2021/049643A1 |
The purpose of the present invention is to provide a lead-free solder alloy and a solder bonded body that, despite no addition of "Ni", have solderability and bonding characteristics as with a "Ni"-added lead-free solder alloy. This le...
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WO/2021/043708A1 |
The present invention relates to a lead-free solder alloy which consists essentially of or consists of: from 0.01 to 11 wt.% of zinc (Zn); from 0.01 to 6 wt.% of bismuth (Bi); from 0.01 to 2 wt.% of gallium (Ga); and, tin (Sn), wherein s...
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WO/2021/043437A1 |
A lead-free solder alloy comprising: from 2.5 to 5 wt.% silver; from 0.01 to 5 wt.% bismuth; from 1 to 7 wt.% antimony; from 0.01 to 2 wt.% copper; one or more of: up to 6 wt.% indium, up to 0.5 wt.% titanium, up to 0.5 wt.% germanium, u...
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WO/2021/033936A1 |
One embodiment of the present invention provides a lead-free alloy for soldering, comprising, on the basis of the total weight, 35-50 wt% of bismuth (Bi), 0.1-1.5 wt% of copper (Cu), 1-6 wt% of indium (In), and the balance of tin (Sn) an...
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WO/2021/029222A1 |
Provided are: a solder alloy having high tensile strength and capable of preventing the occurrence of Ni erosion and also preventing the formation of voids at a bonding interface; and a solder joint. The solder alloy has an alloy composi...
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WO/2021/024568A1 |
An electronic control device is provided with a circuit substrate, an electronic component, and a joint part for joining the circuit substrate and the electronic component to each other, wherein the joint part contains Sn as the main com...
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WO/2021/025081A1 |
Provided is a solder-metal mesh composite material characterized in that a metal mesh that exhibits high thermal conductivity is contained within a lead-free solder layer formed from a Sn-Cu-Ni-based lead-free solder, the proportion of p...
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WO/2021/025071A1 |
Provided is a copper alloy sheet in which a central part in the sheet thickness direction contains more than 2.0% (mass%; hereinafter the same) and not more than 32.5% of Zn, 0.1-0.9% of Sn, not less than 0.05% and less than 1.0% of Ni, ...
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WO/2021/024529A1 |
The present invention addresses the issue of providing: a precursor for an Nb3Sn superconductive wire material that is used in the internal tin process, promotes generation of Nb3Sn, and has a high critical current density; a production ...
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WO/2021/010199A1 |
The present invention pertains to: a SnZn solder characterized in that a total 1–1.5 wt% of a principal material including at least one element from among P, In, Bi, and Sb is mixed with a base material that is an alloy of Sn and Zn, a...
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WO/2020/262632A1 |
A flux according to the present invention is a halogen-free flux used for soldering, the flux containing: a thixotropic agent including a polyamide compound in which one or a plurality of endothermic peaks obtained by differential therma...
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WO/2020/262631A1 |
A flux according to the present invention contains a fatty acid and an imidazole compound.
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WO/2020/262040A1 |
Provided are a solder alloy with which it is possible to cast a cast article having a desired thickness, a cast article, a formed article, and a solder joint. The solder alloy has an alloy composition comprising, in terms of mass%, 0.1-2...
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WO/2020/255874A1 |
Provided is an electroconductive material with which it is possible to continuously perform an arrangement step during printing and to efficiently arrange solder on an electrode. The electroconductive material according to the present ...
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WO/2020/241317A1 |
The present invention addresses the problem of providing: an Sn-Bi-Cu-Ni-based solder alloy which has a low melting point, excellent ductility and high tensile strength, and also has such a property that, when the solder alloy is soldere...
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WO/2020/241437A1 |
Provided is a solder alloy having not only a long-term ability to withstand severe temperature cycle properties such as low temperatures of -40°C and high temperatures of 125°C, but also the long-term capability to withstand force from...
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WO/2020/240928A1 |
Provided is a solder alloy, a solder powder, or the like, which can suppress changes over time of a solder paste, exhibits excellent wettability, has a small difference between liquidus temperature and solidus temperature, exhibits high ...
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WO/2020/240929A1 |
Provided are a solder alloy and a solder powder which can suppress changes over time of a solder paste, exhibits excellent wettability, have a small difference between liquidus temperature and solidus temperature and exhibit high mechani...
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WO/2020/241436A1 |
Provided are a solder alloy which exhibits excellent temperature cycle characteristics and drop impact resistance, suppresses yellowing, maintains excellent wettability and can suppress an increase over time in the viscosity of a solder ...
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WO/2020/241544A1 |
The present invention uses a solder paste that contains a specific solder powder and a specific flux. This solder paste contains a solder powder that includes a solder alloy which has an alloy composition comprising not less than 10 ppm ...
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WO/2020/241316A1 |
Provided are: a solder alloy which suppresses corrosion of Fe in a solder bath, exhibits high mechanical strength in a solder joint and does not cause short-circuits in circuits; and a solder powder, a solder paste, a solder ball, a sold...
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WO/2020/241687A1 |
The purpose of this invention is to provide a soldering flux that suppresses residue cracking of flux residue and has excellent solder wettability. This invention provides a flux composition containing one or more selected from the group...
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WO/2020/241225A1 |
The invention relates to a soldering alloy having an alloy composition containing, in % by mass, 13 to 22% In, 0.5 to 2.8% Ag, 0.5 to 5.0% Bi, and 0.002 to 0.05% Ni, the remainder being Sn. The invention also relates to a soldering paste...
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WO/2020/241574A1 |
The present invention uses a solder paste that contains a specific solder powder and a specific flux. This solder powder contains a solder alloy which has an alloy composition comprising not less than 10 ppm by mass and less than 40 ppm ...
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WO/2020/241319A1 |
Provided are: a solder alloy which has excellent thermal cycle properties, does not undergo yellowish discoloration, can keep the wettability thereof at an excellent level, and enables the prevention of the increase in viscosity of a sol...
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WO/2020/241318A1 |
The present invention provides: a solder alloy which has excellent heat cycle characteristics, while being suppressed in copper leaching and yellowing, and which suppresses viscosity increase over time of a solder paste; a solder paste; ...
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WO/2020/240894A1 |
This flux for soldering a solder alloy contains at least one selected from the group consisting of chlorendic acid amides and chlorendic acid esters.
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WO/2020/240927A1 |
Provided is a solder alloy or the like, which can suppress changes over time of a solder paste, has a small difference between liquidus temperature and solidus temperature, and exhibits high reliability. This solder alloy has an alloy co...
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WO/2020/209077A1 |
A flux which can be used for the soldering of a tin-silver-copper-based alloy comprises an imidazole compound and/or an imidazoline compound, and a dicarboxylic acid having 3 to 36 carbon atoms and a iodine salt of quaternary ammonium, w...
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WO/2020/209330A1 |
Provided is a solder product 20 containing: a lead-free solder section 21 that comprises tin as a main component and a metal element other than lead as a secondary component; and a carboxylic acid that has 10-20 carbon atoms and is distr...
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WO/2020/209384A1 |
The present invention is capable of forming a solder joint part, which has better physical characteristics than before and higher reliability than before while maintaining the melting point of a Sn-Bi-based solder alloy at a low level, b...
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WO/2020/203794A1 |
Provided are: a resin composition for soldering use, which has excellent compatibility with a rosin-based resin and excellent temperature cycle reliability and is therefore suitable for a flux for soldering use; and a soldering compositi...
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WO/2020/201399A1 |
The present invention relates to a method for producing a drawable solder wire, in particular an SnBi solder wire, said method having the following steps: providing a solder alloy; forming a substantially monocrystalline rod from the sol...
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WO/2020/203730A1 |
A flux which can be used in a solder paste comprising the flux and a metal powder, the flux containing 0.5 to 20.0 wt% inclusive of a (2-carboxyalkyl) isocyanurate adduct and 5.0 to 45.0 wt% inclusive of rosin and further containing a so...
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WO/2020/189689A1 |
An aluminum-based wire material provided with a core wire which comprises pure aluminum or an aluminum alloy and a coating layer which is arranged on the outer periphery of the core wire, wherein the coating layer has a first layer arran...
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WO/2020/189359A1 |
A metal particle-containing composition according to the present invention comprises: at least one thermosetting resin (R); a curing agent (H); and at least three metal particles (P) different from each other. The metal particles (P) inc...
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WO/2020/179614A1 |
In the present invention, a high-purity metallic tin suitable for use in an EUV exposure device is provided through use of an oxidation-resistant metallic tin, the oxidation-resistant metallic tin containing 99.995 mass% or more of tin, ...
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WO/2020/179759A1 |
A molding solder according to the present invention is a molding solder that contains: a solder alloy; and a high-melting point metal having a higher melting point than the solder alloy. The molding solder is characterized in that in a c...
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