Title:
FLUX AND SOLDER PASTE
Document Type and Number:
WIPO Patent Application WO/2021/065271
Kind Code:
A1
Abstract:
The present invention relates to a flux including rosin, an active agent, a solvent, and a thixotropic agent containing polyethyleneglycol, wherein the polyethyleneglycol content is 10 to 20% by mass with respect to the total mass of the flux, and the thixotropic agent content excluding the polyethyleneglycol is no greater than 5% by mass with respect to the total mass of the flux.
Inventors:
UKAI RYUJI (JP)
OHTA KENGO (JP)
OKADA SAKIE (JP)
KITAZAWA KAZUYA (JP)
OHTA KENGO (JP)
OKADA SAKIE (JP)
KITAZAWA KAZUYA (JP)
Application Number:
PCT/JP2020/032633
Publication Date:
April 08, 2021
Filing Date:
August 28, 2020
Export Citation:
Assignee:
SENJU METAL INDUSTRY CO (JP)
International Classes:
B23K35/363; B23K35/26; C22C11/06; C22C13/00
Domestic Patent References:
| WO2015037107A1 | 2015-03-19 |
Foreign References:
| JP2018196900A | 2018-12-13 | |||
| JP2013082004A | 2013-05-09 | |||
| JPH05228690A | 1993-09-07 | |||
| JPH10109188A | 1998-04-28 | |||
| JPH10128573A | 1998-05-19 | |||
| JP2019183500A | 2019-10-24 |
Other References:
See also references of EP 4015138A4
Attorney, Agent or Firm:
EIKOH PATENT FIRM, P.C. (JP)
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