Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
SOLDER PASTE AND FLUX FOR SOLDER PASTE
Document Type and Number:
WIPO Patent Application WO/2020/241544
Kind Code:
A1
Abstract:
The present invention uses a solder paste that contains a specific solder powder and a specific flux. This solder paste contains a solder powder that includes a solder alloy which has an alloy composition comprising not less than 10 ppm by mass and less than 40 ppm by mass of As and at least one of 0-25,000 ppm by mass of Bi and 0-8000 ppm by mass of Pb, with the remainder comprising Sn, and the solder alloy satisfies formula (1) and formula (2). Formula (1): 300 ≤ 3As+Bi+Pb Formula (2): 0 < 2.3×10-4×Bi+8.2×10-4×Pb ≤ 7 In formula (1) and formula (2), As, Bi and Pb denote the content values (ppm by mass) of these components in the alloy composition.

More Like This:
JP5018978Conductive material, connection method using it, and connection structure
WO/2019/146587JOINING LAYER OF SEMICONDUCTOR MODULE, SEMICONDUCTOR MODULE, AND METHOD FOR MANUFACTURING SAME
WO/2006/049024HIGH TEMPERATURE LEAD-FREE SOLDER AND PACKAGE FOR STORING SEMICONDUCTOR ELEMENT
Inventors:
KAWASAKI HIROYOSHI (JP)
SHIRATORI MASATO (JP)
KAWAMATA YUJI (JP)
Application Number:
PCT/JP2020/020464
Publication Date:
December 03, 2020
Filing Date:
May 25, 2020
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
SENJU METAL INDUSTRY CO (JP)
International Classes:
C22C13/00; B23K35/26; B23K35/363; C22C13/02
Domestic Patent References:
WO2020017157A12020-01-23
Foreign References:
JP2002224881A2002-08-13
JP2016500578A2016-01-14
JP2015098052A2015-05-28
Attorney, Agent or Firm:
OIKAWA Shu et al. (JP)
Download PDF:
View/Download PDF      PDF Help



 
Previous Patent: GAS TURBINE, METHOD FOR CONTROLLING SAME, AND COMBINED CYCLE PLANT

Next Patent: INFORMATION PROCESSING DEVICE