SOLDER ALLOY, SOLDER POWDER AND SOLDER JOINT

WIPO Patent Application WO/2020/240929

A1

Provided are a solder alloy and a solder powder which can suppress changes over time of a solder paste, exhibits excellent wettability, have a small difference between liquidus temperature and solidus temperature and exhibit high mechanical characteristics; and a solder joint. This solder alloy has an alloy composition comprising not less than 10 ppm by mass and less than 25 ppm by mass of As and at least one of 0-25,000 ppm by mass of Bi and 0-8000 ppm by mass of Pb, with the remainder comprising Sn, and the solder alloy satisfies formula (1) and formula (2). Formula (1): 300 ≤ 3As+Bi+Pb Formula (2): 0 < 2.3×10-4×Bi+8.2×10-4×Pb ≤ 7 In formula (1) and formula (2), As, Bi and Pb denote the content values (ppm by mass) of these components in the alloy composition.

JPH0428496	PRODUCTION OF SOLDERING WAX FOR SOLDER WELDING OF ALUMINUM-ALUMINUM, ALUMINUM-DIFFERENT METAL AND ALLOY AND BLANK FOR SOLDER WELDING
JP6897237	Molded body for joining and its manufacturing method
JP5115915	Lead-free solder, its soldered products, solder paste and electronic component soldering boards

KAWASAKI HIROYOSHI (JP)
MUNEKATA OSAMU (JP)
SHIRATORI MASATO (JP)

PCT/JP2020/003715

December 03, 2020

January 31, 2020

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SENJU METAL INDUSTRY CO (JP)

B23K35/26; C22C13/00; C22C13/02

WO2013108421A1	2013-07-25
WO2014192521A1	2014-12-04

JP2015098052A	2015-05-28
JP2002224881A	2002-08-13
JP2013237091A	2013-11-28
JPH0221161B2	1990-05-14

KENMOTSU Hidetaka (JP)

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