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WO/2018/186218A1 |
Provided is a solder material including 2.5-3.3 wt% Ag, 0.3-0.5 wt% Cu, 5.5-6.4 wt% In, and 0.5-1.4 wt% Sb, the remainder being unavoidable impurities and Sn. Specifically, the solder material is a Pb-free solder not including Pb.
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WO/2018/181873A1 |
Provided are a solder alloy, a solder paste, and a solder joint which provide high reliability in that the solder alloy has a high tension strength and that excellent vibration resistance is achieved at a joint part between a printed-cir...
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WO/2018/181690A1 |
The lead-free solder alloy according to the present invention is a Sn-Ag-Cu-based lead-free solder alloy that is used for soldering a member to be joined that contains Al at least in the surface layer thereof, the lead-free solder alloy ...
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WO/2018/174066A1 |
Provided are conductive particles which can be easily mounted at low temperatures, and which are capable of effectively improving impact resistance of connection parts. Conductive particles according to the present invention are provided...
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WO/2018/174162A1 |
This solder joint has used therein an Sn-Cu-Ni-Bi-Ge-based lead-free solder alloy, wherein the lead-free solder alloy is configured from an alloy comprising 0.1-2.0% by weight of a Cu additive, 0.05-0.5% by weight of a Ni additive, 0.1-8...
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WO/2018/168858A1 |
Provided is a solder material which has excellent thermal cycle fatigue characteristics and excellent wettability. A solder material which contains from 5.0% by mass to 8.0% by mass (inclusive) of Sb and from 3.0% by mass to 5.0% by mass...
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WO/2018/164171A1 |
The purpose of the present invention is to provide a lead-free solder alloy, solder paste, and electronic circuit board that ensure reliable connections between solder joints and electronic components by suppressing thermomigration, whic...
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WO/2018/161416A1 |
The invention discloses a liquid metal thermal interface material with a melt-back property and a preparation method thereof. The liquid metal thermal interface material is characterized by containing in percent by weight: 20-40 wt% of i...
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WO/2018/159664A1 |
Provided is a solder material which is capable of suppressing the occurrence of electromigration. This solder material is a core ball 1A which comprises a spherical core 2A that is configured from Cu or a Cu alloy, and a solder layer 3A ...
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WO/2018/135426A1 |
The present invention is a flux, etc., including a terpene phenol resin and having an acid value of 120 mg KOH/g or greater.
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WO/2018/135427A1 |
Flux, etc., that includes a terpene phenol resin that has a hydroxyl value of at least 110 mgKOH/g.
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WO/2018/134673A1 |
Provided is a soldering method for bonding an electrode on a substrate and an electrode on an electronic component by forming a solder joint that exhibits superior connection reliability while reducing thermal damage to the electronic co...
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WO/2018/129476A1 |
Contemplated is a magnetocaloric materials comprising: (CexNd1 -x)Si wherein x is in the range of about 0.1 to about 0.9, and wherein the magnetocaloric material exhibits a 2nd order magnetic phase transition in the temperature range of ...
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WO/2018/096061A1 |
A method for synthesising an Ag-Sn intermetallic compound comprising the following sequence of steps: - a step of providing a mixture (E1) during which a solution of a mixture of a silver salt and a protective agent in a polyol solvent i...
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WO/2018/096917A1 |
The purpose of the present invention is to prevent solder from scattering during a reflow process and to reliably remove oxide films formed on surfaces of the solder and an electrode. A soldering method according to the present invention...
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WO/2018/084072A1 |
A flux which contains at least one component selected from the group consisting of diglycolic acid and salts thereof; and the like.
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WO/2018/071931A1 |
The invention relates to a multilayer sliding bearing element comprising a supporting layer and a sliding layer, wherein the sliding layer consists of a white metal comprising the elements of tin, zinc and copper, the proportion of coppe...
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WO/2018/066657A1 |
Provided is a thermoelectric material which has excellent heat resistance and is suppressed in decrease of thermoelectric characteristics even in a high temperature environment. This thermoelectric material is obtained by substituting at...
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WO/2018/067426A1 |
Improved electrical and thermal properties of solder alloys are achieved by the use of micro-additives in solder alloys to engineer the electrical and thermal properties of the solder alloys and the properties of the reaction layers betw...
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WO/2018/062255A1 |
This copper alloy sheet for a heat dissipation component is characterized in that: the copper alloy sheet for a heat dissipation component comprises 0.05-0.9% by mass of Co, and 0.01-0.25% by mass of P, the balance being Cu and inevitabl...
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WO/2018/056313A1 |
Provided is a multilayer metal ball having excellent spacer function and high bonding reliability. The multilayer metal ball 1 comprises a core ball 2 formed from Sn or Sn alloy, and an intermediate plated layer 3 of which the thickness ...
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WO/2018/056314A1 |
Provided is a multilayer metal ball having a superior spacer function and high bond reliability. With this multilayer metal ball 1, deformation thereof when the multilayer metal ball 1 has been mounted to an electronic component can be s...
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WO/2018/056315A1 |
Provided is a multilayer metal ball having a superior spacer function and high bond reliability. In this multilayer metal ball 1, the thickness of an intermediate plating layer 3 can be made more uniform and irregularity in an interface ...
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WO/2018/051973A1 |
Provided is a solder alloy that has excellent wettability for preventing soldering defects, enables high bond strength in solder joints after soldering, suppresses breakage at bond interfaces, and also suppresses EM generation. In order ...
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WO/2018/046763A1 |
A solder alloy comprises 38.0-42.0 wt% bismuth (Bi), 0.01-2 wt% of at least one further element chosen from the group of manganese (Mn), antimony (Sb) and copper (Cu), the balance being tin (Sn), and is at least substantially free of nic...
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WO/2018/042890A1 |
A semiconductor element 11 is bonded to an insulating substrate 14 by means of a bonding layer which is obtained by: forming a network of a porous metal 30 based on a porous metal body 3, said porous metal 30 being formed using a bonded ...
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WO/2018/034320A1 |
Provided are a solder alloy for preventing Fe erosion, a resin flux cored solder, a wire solder, a resin flux cored wire solder, a flux coated solder, a solder joint, and a soldering method which, in order to prolong the life of a solder...
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WO/2018/025903A1 |
The purpose of the present invention is to provide a solder paste flux with which it is possible to form a solder joint that produces less voids. The solder paste flux according to the present invention contains, as the main component, a...
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WO/2018/025798A1 |
Provided is a composition containing metal particles, whereby high-strength joining between metals of electronic components or the like is possible at relatively low temperature. A composition containing metal particles, characterized by...
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WO/2018/021540A1 |
Thermoelectric materials according to an embodiment of the present invention are a plurality of p-type and n-type thermoelectric materials which constitute a thermoelectric conversion element. Provided are thermoelectric materials, a the...
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WO/2018/012642A1 |
A novel solder alloy is provided which contains Sn, Bi and Zn, with Bi 42-62 mass%, Zn 0.2-3.6 mass%, and the remainder Sn and unavoidable impurities; this solder alloy can be used in a low temperature range.
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WO/2018/008165A1 |
Provided is a solder alloy in which depletion of the plating layer can be effectively prevented, even under repeated contact in a molten state with a plating layer of which the primary component is Fe. This solder alloy comprises 0.01-0....
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WO/2018/003760A1 |
The purpose of the invention is to provide a flux composition and a solder paste composition with which it is possible to suppress the stickiness of flux residue after soldering while suppressing the creation of voids during reflow solde...
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WO/2018/001574A1 |
The invention relates to a thermoelectric article for a thermoelectric conversion device having a total composition consisting essentially of 6 at.% ≤ Ti ≤ 27 at.%, 6 at.% ≤ Zr < 27 at.%, 0 at.% ≤ Hf ≤ 1.7 at.%, wherein 28 at.%...
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WO/2018/003820A1 |
The purpose of the invention is to provide a flux composition and a solder paste composition capable of ensuring excellent printability regardless of the thickness and opening diameter of a metal mask without impairing solderability (the...
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WO/2017/221861A1 |
The purpose of the present invention is to provide a solder paste with which, in a solder joint joining an electronic component electrode and a printed circuit board electrode, the effect of an additive element can be obtained and a low ...
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WO/2017/221425A1 |
[Problem] To provide a guide wire that ensures the strength of joining between a core shaft and a coil body even when the materials of the core shaft and the coil body are variously changed, particularly, when the core shaft and the coil...
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WO/2017/217145A1 |
The present invention suppresses a fracture at the interface between different materials. A solder bonded part which comprises: a solder bonding layer 10 wherein a solder material, which contains more than 5.0% by mass but 10.0% by mass ...
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WO/2017/200361A2 |
The present invention relates to a lead-free solder alloy composition and a preparation method therefor, the composition comprising: a Sn-Ag-Cu first alloy; a Sn-Bi second alloy; one or more third alloys selected from Sn-Ag and Sn-Cu all...
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WO/2017/198795A1 |
The present invention relates to novel composite materials enriched with silicon dispersed in matrices comprising Ni, Ti and Si and/or Sn, optionally passivated. The invention also relates to the method for producing said materials and t...
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WO/2017/192517A1 |
Lead-free solder alloys are described that exhibit favorable high temperature mechanical reliability and thermal fatigue resistance, and are typically capable of withstanding operational temperatures of at least 150°C, for example up to...
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WO/2017/179250A1 |
A semiconductor package manufacturing method of the present invention is characterized by having: a step for preparing a lead frame having a section to be cut, said section being formed of a Cu alloy; a step for applying a bonding materi...
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WO/2017/179532A1 |
Provided is a conductive material which is capable of efficiently arranging a solder between electrodes to be connected, thereby being capable of enhancing the conduction reliability and insulation reliability. A conductive material acco...
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WO/2017/164194A1 |
The purpose of the present invention is to provide the following: a lead-free solder alloy which can suppress development of cracks in soldered junctions even in harsh environments in which large temperature differences occur and the vib...
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WO/2017/160132A2 |
The present invention relates to a thin film material in which at least two kinds of metals are electroplated. In a first heating, melting occurs at a melting point (Tms) of a metal having a low melting point from among the metals, and a...
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WO/2017/159842A1 |
This magnesium-based thermoelectric conversion material is characterized in that a first layer formed of Mg2Si and a second layer formed of Mg2SixSn1-x (where x is 0 or more but less than 1) are directly joined, and in that the second la...
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WO/2017/154329A1 |
This production method is for a joined body wherein a first member and a second member are joined. The production method is characterized by including: an arrangement step for arranging a joining material between the first member and the...
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WO/2017/154330A1 |
This joining material includes a first metal powder and a second metal powder that has a higher melting point than the first metal powder. The joining material is characterized in that the first metal powder comprises Sn or an alloy that...
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WO/2017/154740A1 |
Provided is high-purity tin having a purity of 5N (99.999 mass%) or higher, wherein the high-purity tin has particles suppressed by high-purity tin that has 50,000 or fewer particles having a grain size of 0.5 μm or greater per 1 g.
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WO/2017/154957A1 |
The purpose of the present invention is to provide a solder alloy, a solder ball, a chip solder, a solder paste, and a solder joint in which discoloration is suppressed and the growth of an oxide film is suppressed in a high-temperature ...
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