Title:
CU CORE BALL
Document Type and Number:
WIPO Patent Application WO/2014/203348
Kind Code:
A1
Abstract:
Provided is a Cu core ball that is capable of suppressing soft errors and thus reducing connection failures. The Cu core ball is provided with a solder plating film that is formed on the surface of a Cu ball, wherein: the solder plating film comprises an Sn solder plating film or a lead-free solder alloy containing Sn as a major component and having a U content of 5 ppb or less and a Th content of 5 ppb or less; the purity of the Cu ball is 99.9-99.995% inclusive, the sum of the Pb and/or Bi contents thereof is 1 ppm or more, and the sphericity thereof is 0.95 or more; and the α ray amount of the obtained Cu core ball is 0.0200 cph/cm2 or less.
Inventors:
KAWASAKI HIROYOSHI (JP)
HASHIMOTO TOMOHIKO (JP)
IKEDA ATSUSHI (JP)
ROPPONGI TAKAHIRO (JP)
SOMA DAISUKE (JP)
SATO ISAMU (JP)
KAWAMATA YUJI (JP)
HASHIMOTO TOMOHIKO (JP)
IKEDA ATSUSHI (JP)
ROPPONGI TAKAHIRO (JP)
SOMA DAISUKE (JP)
SATO ISAMU (JP)
KAWAMATA YUJI (JP)
Application Number:
PCT/JP2013/066827
Publication Date:
December 24, 2014
Filing Date:
June 19, 2013
Export Citation:
Assignee:
SENJU METAL INDUSTRY CO (JP)
International Classes:
B22F1/17; B23K35/14; B23K35/26; C22C13/00; H01L21/60; H05K3/34
Domestic Patent References:
| WO2007004394A1 | 2007-01-11 |
Foreign References:
| JP2011029395A | 2011-02-10 | |||
| JP2001237259A | 2001-08-31 | |||
| JP2005036301A | 2005-02-10 | |||
| JP2005002428A | 2005-01-06 | |||
| JPH0724113A | 1995-01-27 | |||
| JP4472752B2 | 2010-06-02 |
Other References:
See also references of EP 3012047A4
Attorney, Agent or Firm:
YAMAGUCHI INTERNATIONAL PATENT FIRM (JP)
Patent business corporation Yamaguchi international patent firm (JP)
Patent business corporation Yamaguchi international patent firm (JP)
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