Title:
LEAD-FREE SOLDER
Document Type and Number:
WIPO Patent Application WO/2000/076717
Kind Code:
A1
Abstract:
A lead-free solder which comprises substantially Sn and Ti and has a liquidus line temperature of 400°C or lower. The solder is free of lead which is a hazardous substance and also exhibits a satisfactory bonding strength toward an oxide material such as glass or ceramics.
Inventors:
DOMI SHINJIRO (JP)
SAKAGUCHI KOICHI (JP)
NAKAGAKI SHIGEKI (JP)
SUGANUMA KATSUAKI (JP)
SAKAGUCHI KOICHI (JP)
NAKAGAKI SHIGEKI (JP)
SUGANUMA KATSUAKI (JP)
Application Number:
PCT/JP2000/003631
Publication Date:
December 21, 2000
Filing Date:
June 05, 2000
Export Citation:
Assignee:
NIPPON SHEET GLASS CO LTD (JP)
DOMI SHINJIRO (JP)
SAKAGUCHI KOICHI (JP)
NAKAGAKI SHIGEKI (JP)
SUGANUMA KATSUAKI (JP)
DOMI SHINJIRO (JP)
SAKAGUCHI KOICHI (JP)
NAKAGAKI SHIGEKI (JP)
SUGANUMA KATSUAKI (JP)
International Classes:
B23K35/26; C22C13/00; C22C13/02; (IPC1-7): B23K35/26; C22C13/02
Foreign References:
| JPH1177370A | 1999-03-23 | |||
| JPH0195893A | 1989-04-13 | |||
| JPH02179386A | 1990-07-12 | |||
| JPH04305073A | 1992-10-28 | |||
| JPS6471592A | 1989-03-16 | |||
| JPS53124148A | 1978-10-30 | |||
| JPS6418981A | 1989-01-23 |
Attorney, Agent or Firm:
Shigeno, Tsuyoshi (9th floor 5-10 Shinjuku 2-chome Shinjuku-ku, Tokyo, JP)
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