Title:
SOLDER, SOLDER PASTE AND SOLDERING METHOD
Document Type and Number:
WIPO Patent Application WO/1997/028923
Kind Code:
A1
Abstract:
Solder and solder paste used for soldering an electronic part to a circuit board. This solder comprises 2.0-3.5 wt.% of Ag, 5-18 wt.% of Bi, and Sn for the rest. In another embodiment, the solder further contains at least one kind of element selected from the group consisting of 0.1-1.5 wt.% of In, 0.1-0.7 wt.% of Cu and 0.1-10 wt.% of Zn.
Inventors:
YAMAGUCHI ATSUSHI (JP)
FUKUSHIMA TETSUO (JP)
SUETSUGU KENICHIRO (JP)
FURUSAWA AKIO (JP)
FUKUSHIMA TETSUO (JP)
SUETSUGU KENICHIRO (JP)
FURUSAWA AKIO (JP)
Application Number:
PCT/JP1996/002138
Publication Date:
August 14, 1997
Filing Date:
July 29, 1996
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD (JP)
YAMAGUCHI ATSUSHI (JP)
FUKUSHIMA TETSUO (JP)
SUETSUGU KENICHIRO (JP)
FURUSAWA AKIO (JP)
YAMAGUCHI ATSUSHI (JP)
FUKUSHIMA TETSUO (JP)
SUETSUGU KENICHIRO (JP)
FURUSAWA AKIO (JP)
International Classes:
B23K1/00; B23K31/02; B23K35/14; B23K35/22; B23K35/26; C22C13/02; H05K3/34; B23K35/02; (IPC1-7): B23K35/22; B23K35/26; B23K35/363; H05K3/34
Foreign References:
| JPH06238479A | 1994-08-30 | |||
| JPH05228685A | 1993-09-07 | |||
| JPH0732188A | 1995-02-03 | |||
| JPH06344180A | 1994-12-20 | |||
| JPH0751883A | 1995-02-28 | |||
| JPH0788679A | 1995-04-04 | |||
| JPH0788680A | 1995-04-04 | |||
| JPH0788681A | 1995-04-04 | |||
| JPH071179A | 1995-01-06 | |||
| JPH07509662A | 1995-10-26 | |||
| JPH0687090A | 1994-03-29 | |||
| JPH05318176A | 1993-12-03 | |||
| JPH04220192A | 1992-08-11 | |||
| JPH04270062A | 1992-09-25 | |||
| JPH04270063A | 1992-09-25 | |||
| JPH08132277A | 1996-05-28 | |||
| JPH08132279A | 1996-05-28 |
Other References:
See also references of EP 0878265A4
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