LEAD-FREE SOLDER - NIHON SUPERIOR SHA CO LTD

Title:

LEAD-FREE SOLDER

Document Type and Number:

WIPO Patent Application WO/2000/024544

Kind Code:

A1

Abstract:

A lead-free solder characterized as comprising 0.1 to 2 wt % of Cu, 0.002 to 1 wt % of Ni with the residue being Sn. The solder preferably contains Cu in an amount of 0.3 to 0.7 wt %, and more preferably it contains Cu in an amount of 0.3 to 0.7 wt % and Ni in an amount of 0.04 to 0.1 wt %. The solder can be prepared by adding Ni to a molten mother alloy of Sn-Cu, or by adding Cu to a molten mother alloy of Sn-Ni. A lead-free solder which further comprises 0.001 to 1 wt % of Ga is also disclosed. The lead-free solder can form a solder joint having a high strength and stability comparable to those of a conventional Sn-Pb eutectic solder.

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Inventors:

NISHIMURA TETSURO (JP)

Application Number:

PCT/JP1999/005275

Publication Date:

May 04, 2000

Filing Date:

September 28, 1999

Export Citation:

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Assignee:

NIHON SUPERIOR SHA CO LTD (JP)
NISHIMURA TETSURO (JP)

International Classes:

B23K35/26; C22C13/00; H05K1/09; H05K3/34; B23K; C22C; (IPC1-7): B23K35/26; C22C13/00

Foreign References:

US4758407A	1988-07-19
EP0847829A1	1998-06-17
JPH0138109C2

Other References: