Title:
LEAD-FREE SOLDER ALLOY, SOLDER PASTE, ELECTRONIC CIRCUIT-MOUNTED SUBSTRATE, AND ELECTRONIC CONTROL DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/235001
Kind Code:
A1
Abstract:
Provided are: a lead-free solder alloy, which is a means that can achieve both of a cracking propagation prevention effect and resistance to impact associated with high-speed deformation at a solder joint part under an environment where the temperature difference is extreme, and which can be used suitably particularly in an in-vehicle electronic mounted substrate and an in-vehicle electronic control device, the lead-free solder alloy being characterized by containing 2 to 4% by mass inclusive of Ag, 0.3 to 1% by mass inclusive of Cu, 1.5% by mass or more and less than 3% by mass of Bi, and 1% by mass or more and less than 3% by mass of In, with the remainder made up by Sn; a solder paste; an electronic circuit-mounted substrate; and an electronic control device.
Inventors:
ARAI MASAYA (JP)
NAKANO TAKESHI (JP)
KATSUYAMA TSUKASA (JP)
MUNEKAWA YURIKA (JP)
MARUYAMA DAISUKE (JP)
SHIMAZAKI TAKANORI (JP)
NAKANO TAKESHI (JP)
KATSUYAMA TSUKASA (JP)
MUNEKAWA YURIKA (JP)
MARUYAMA DAISUKE (JP)
SHIMAZAKI TAKANORI (JP)
Application Number:
PCT/JP2019/007717
Publication Date:
December 12, 2019
Filing Date:
February 27, 2019
Export Citation:
Assignee:
TAMURA SEISAKUSHO KK (JP)
International Classes:
B23K35/26; C22C13/00; C22C13/02; H05K3/34
Domestic Patent References:
| WO2000018536A1 | 2000-04-06 |
Foreign References:
| JP2014037005A | 2014-02-27 | |||
| JP2016010818A | 2016-01-21 | |||
| JP2001168519A | 2001-06-22 | |||
| JP2015205345A | 2015-11-19 |
Attorney, Agent or Firm:
OTA Yoko (JP)
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