Title:
SOLDER WIRE
Document Type and Number:
WIPO Patent Application WO/2024/057765
Kind Code:
A1
Abstract:
[Problem] To provide a solder wire which has a structure wherein: a resin is coated on a flux layer that is coated on the surface of a solder part for the purpose of preventing adhesion of the flux layer, while taking hygiene and health into consideration; and the coating resin is not infiltrated or fused with the underlying flux at room temperature, while having no adhesiveness, and does not hamper the function of the flux during soldering. [Solution] A solder wire which is provided with a solder part 2 that is configured from a solder alloy, a flux layer 3 that is coated on the surface of the solder part 2, and a resin layer 4 that is coated on the surface of the flux layer 3, and which is characterized in that the resin layer 4 is formed of an acrylic resin.
Inventors:
KOJIMA MASAO (JP)
Application Number:
PCT/JP2023/028517
Publication Date:
March 21, 2024
Filing Date:
August 04, 2023
Export Citation:
Assignee:
KOJIMA SOLDER CO LTD (JP)
International Classes:
B23K35/14; B23K35/26; B23K35/40; C22C13/00
Domestic Patent References:
| WO1993015870A1 | 1993-08-19 |
Foreign References:
| JPS4819457A | ||||
| JPS3719542Y1 | ||||
| JPS4325896B1 | ||||
| JPS558394A | 1980-01-21 | |||
| JPH03184694A | 1991-08-12 | |||
| JP2006255762A | 2006-09-28 | |||
| JP2020131219A | 2020-08-31 | |||
| JP2005074511A | 2005-03-24 | |||
| JPH01241394A | 1989-09-26 | |||
| CN112756848A | 2021-05-07 |
Attorney, Agent or Firm:
ABIKO Gen (JP)
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