Title:
SOLDER PARTICLE MANUFACTURING METHOD, SOLDER PARTICLE, AND CONDUCTIVE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/053722
Kind Code:
A1
Abstract:
Provided is a solder particle manufacturing method, including: a curing step for curing solder particles such that a hardness K value at 70% compressive deformation is 850 N/mm2 to 1,500 N/mm2; and a classifying step for classifying the cured solder particles after curing by forcibly generating an air flow with a classifying device.
Inventors:
YAMAGUCHI SARII (JP)
NAMIKI HIDETSUGU (JP)
NISHIO TAKESHI (JP)
NAMIKI HIDETSUGU (JP)
NISHIO TAKESHI (JP)
Application Number:
PCT/JP2022/030080
Publication Date:
April 06, 2023
Filing Date:
August 05, 2022
Export Citation:
Assignee:
DEXERIALS CORP (JP)
International Classes:
B22F1/14; B07B7/06; B23K35/26; B23K35/40; C22C12/00; C22C13/02
Domestic Patent References:
| WO2013125517A1 | 2013-08-29 |
Foreign References:
| JP2000094179A | 2000-04-04 | |||
| JP2004034083A | 2004-02-05 | |||
| JP2004209494A | 2004-07-29 | |||
| JPH1052789A | 1998-02-24 | |||
| JP2010131605A | 2010-06-17 | |||
| JP6439893B1 | 2018-12-19 |
Attorney, Agent or Firm:
ITOH, Tadashige et al. (JP)
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