Title:
SOLDER AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/139976
Kind Code:
A1
Abstract:
The present invention provides a technology which improves the connection reliability of a solder connection of a semiconductor device in a high temperature environment, while being capable of reducing wet spreading failure of a solder. As a means for achieving the above, the present invention uses a solder for the connection of a semiconductor element, the solder containing Sn with a Cu content of 3 to 9 wt% and an Sb content of 6.7 to 9.6 wt%, while being added with one or more elements that are selected from among 0.004 to 0.01 wt% of Fe, 0.002 to 0.04 wt% of Bi, 0.01 to 0.09 wt% of Pb ad 0.0125 to 0.02 wt% of As.
Inventors:
IKEDA OSAMU (JP)
KUMAGAI YUKIHIRO (JP)
BANNO YUICHIRO (JP)
KUMAGAI YUKIHIRO (JP)
BANNO YUICHIRO (JP)
Application Number:
PCT/JP2022/045811
Publication Date:
July 27, 2023
Filing Date:
December 13, 2022
Export Citation:
Assignee:
HITACHI POWER SEMICONDUCTOR DEVICE LTD (JP)
International Classes:
B23K35/26; C22C13/00; C22C13/02; H01L21/52; H05K3/34
Domestic Patent References:
| WO2015075788A1 | 2015-05-28 |
Foreign References:
| JPH0788679A | 1995-04-04 | |||
| JPS55127027A | 1980-10-01 | |||
| JPS4963382A | 1974-06-19 |
Attorney, Agent or Firm:
TSUTSUI & ASSOCIATES (JP)
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