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Title:
FLUX AND SOLDER PASTE
Document Type and Number:
WIPO Patent Application WO/2023/063160
Kind Code:
A1
Abstract:
In the present invention, a flux containing an organic acid (AC1), a solvent (S1), and a compound (AZ1) that has a benzotriazole skeleton is employed. The AC1 is such that the rate of decrease in weight when held for 15 minutes at 140°C is 20 mass% or less. The S1 is such that the rate of decrease in weight when held for 15 minutes at 140°C is 50 mass% or less.

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Inventors:
KAWANAGO TOMOHISA (JP)
KAJIKAWA YASUHIRO (JP)
IKEDA ATSUSHI (JP)
Application Number:
PCT/JP2022/037067
Publication Date:
April 20, 2023
Filing Date:
October 04, 2022
Export Citation:
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Assignee:
SENJU METAL INDUSTRY CO (JP)
International Classes:
C22C13/00; B23K35/26; B23K35/363
Foreign References:
JPH0388386A1991-04-12
JPH03238195A1991-10-23
JP2002361484A2002-12-18
JP2004058104A2004-02-26
JP2003225796A2003-08-12
CN104923987A2015-09-23
JPH08155677A1996-06-18
Attorney, Agent or Firm:
OIKAWA Shu et al. (JP)
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