Title:
FLUX, SOLDER PASTE, AND METHOD FOR PRODUCING BONDED BODY
Document Type and Number:
WIPO Patent Application WO/2024/024676
Kind Code:
A1
Abstract:
This flux contains a first solvent and a thixotropic agent. The first solvent either has a viscosity of 10 Pa•s or more at 30°C or is a solid at 30°C, has a boiling point of 200°C or more, and has a weight loss rate of less than 96 mass% when heated to 230°C. The thixotropic agent contains a polyamide that is one or more substances selected from the group consisting of condensates of an aliphatic carboxylic acid and an amine and condensates of an aliphatic carboxylic acid, a hydroxy group-containing aliphatic carboxylic acid, and an amine. The content of the first solvent is 30 mass% or more with respect to the total mass of flux. The content of the polyamide exceeds 2 mass% with respect to the total mass of flux.
Inventors:
SHINOZAKI KEISUKE (JP)
KITAZAWA KAZUYA (JP)
KAWAMATA HIROAKI (JP)
FUJINO YUKI (JP)
KITAZAWA KAZUYA (JP)
KAWAMATA HIROAKI (JP)
FUJINO YUKI (JP)
Application Number:
PCT/JP2023/026807
Publication Date:
February 01, 2024
Filing Date:
July 21, 2023
Export Citation:
Assignee:
SENJU METAL INDUSTRY CO (JP)
International Classes:
B23K35/363; B23K35/26; C22C13/00; H05K3/34
Domestic Patent References:
| WO2017065076A1 | 2017-04-20 |
Foreign References:
| CN109877484A | 2019-06-14 | |||
| JP2009542019A | 2009-11-26 | |||
| JP2004025305A | 2004-01-29 | |||
| JP2015160244A | 2015-09-07 | |||
| JP2019122994A | 2019-07-25 | |||
| JP2022080827A | 2022-05-30 |
Attorney, Agent or Firm:
OIKAWA Shu et al. (JP)
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