Title:
FLUX AND SOLDER PASTE
Document Type and Number:
WIPO Patent Application WO/2023/171471
Kind Code:
A1
Abstract:
The present invention provides a flux and a solder paste, which are capable of reducing cracking of a flux residue due to temperature change, while being capable of suppressing separation of a solder paste into a solder powder and a flux with time during storage, and which are also capable of suppressing a decrease in the soldering strength in cases where an underfill is used. The present invention employs a flux which contains a resin component, an activator and a solvent. The resin component contains: a copolymer (A) which has a repeating unit (a1) that is derived from an alkene and a repeating unit (a2) that is derived from an acrylic acid, wherein a hydrogen atom bonded to a carbon atom in the α-position may be substituted by a substituent; and a rosin (B). The mixing ratio of the copolymer (A) to the rosin (B) is 1 or more in terms of the mass ratio expressed by (copolymer (A))/(rosin (B)).
Inventors:
KANEKO MUTSUKI (JP)
TSUDA RYUICHI (JP)
TAKAGI KAZUYORI (JP)
TSUDA RYUICHI (JP)
TAKAGI KAZUYORI (JP)
Application Number:
PCT/JP2023/007435
Publication Date:
September 14, 2023
Filing Date:
February 28, 2023
Export Citation:
Assignee:
SENJU METAL INDUSTRY CO (JP)
International Classes:
C22C13/00; B23K35/26; B23K35/363
Domestic Patent References:
| WO2013108663A1 | 2013-07-25 |
Foreign References:
| JPH09122975A | 1997-05-13 |
Attorney, Agent or Firm:
OIKAWA Shu et al. (JP)
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