Title:
FLUX AND SOLDER PASTE
Document Type and Number:
WIPO Patent Application WO/2022/270499
Kind Code:
A1
Abstract:
Provided are a flux and a solder paste having good reflow properties and flux residue cleaning properties, wherein changes in viscosity over time upon storage at 30°C are suppressed and coloring of flux residue can be suppressed. A flux, containing rosin, a thixotropic agent, an activator and a solvent, is employed as such a flux. The rosin includes at least one selected from the group consisting of acid-modified rosin, hydrogenated rosin, and acid-modified hydrogenated rosin, and the thixotropic agent includes a compound represented by general formula (1). In general formula (1), R11 and R12 each independently represent a C1-C3 hydrocarbon group that may have a substituent, or a single bond. R21 and R22 each independently represent a C7-C29 hydrocarbon group that may have a substituent. R13 is a substituent. n represents an integer of 0-4.
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Inventors:
HASHIMOTO YUTAKA (JP)
KANEKO MUTSUKI (JP)
KANEKO MUTSUKI (JP)
Application Number:
PCT/JP2022/024711
Publication Date:
December 29, 2022
Filing Date:
June 21, 2022
Export Citation:
Assignee:
SENJU METAL INDUSTRY CO (JP)
International Classes:
C22C13/00; B23K35/26; B23K35/363
Foreign References:
| JP2006167802A | 2006-06-29 | |||
| JP2004202518A | 2004-07-22 | |||
| JP2001138089A | 2001-05-22 | |||
| JP2008100262A | 2008-05-01 | |||
| JP6575709B1 | 2019-09-18 | |||
| JPH10249577A | 1998-09-22 | |||
| JPH07144293A | 1995-06-06 | |||
| JPH10328882A | 1998-12-15 | |||
| JP2020175415A | 2020-10-29 | |||
| JP2021104992A | 2021-07-26 | |||
| JPH10249577A | 1998-09-22 | |||
| JP2014117745A | 2014-06-30 |
Attorney, Agent or Firm:
OIKAWA Shu et al. (JP)
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