Title:
SURFACE TREATMENT AGENT FOR COPPER OR COPPER ALLOY
Document Type and Number:
WIPO Patent Application WO/2023/190263
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a surface treatment agent that exhibits excellent heat resistance of a chemical conversion film formed on a copper surface and ensures good solderability during soldering. A surface treatment agent for copper or copper alloy according to the present invention contains: an imidazole compound represented by chemical formula (I) or a benzimidazole compound represented by chemical formula (II); and a triazole compound represented by chemical formula (III). The definition of each substituent in chemical formulae (I)-(III) is the same as that defined in the specification.
Inventors:
MAE TOMOYA (JP)
YOSHINARI KOICHI (JP)
NAKANISHI MASATO (JP)
YOSHINARI KOICHI (JP)
NAKANISHI MASATO (JP)
Application Number:
PCT/JP2023/012043
Publication Date:
October 05, 2023
Filing Date:
March 24, 2023
Export Citation:
Assignee:
SHIKOKU CHEM (JP)
International Classes:
C23F11/14; B23K35/26; C22C13/00; C23C22/52
Foreign References:
| JP2001357722A | 2001-12-26 | |||
| JPH04173983A | 1992-06-22 | |||
| KR20200017269A | 2020-02-18 | |||
| JP2007297685A | 2007-11-15 |
Attorney, Agent or Firm:
Eikoh, P.C. (JP)
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