Title:
FLUX AND METHOD FOR PRODUCING ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2024/043231
Kind Code:
A1
Abstract:
Provided is a flux that can suppress the generation of voids when an indium alloy sheet is used to perform a continuous reflow under different temperature conditions. The present invention employs a flux that contains a rosin ester, an organic acid (A), and a solvent (S). The organic acid (A) includes a dimer acid (A1) that demonstrates a weight reduction rate of not more than 1 mass% in a thermogravimetric analysis in which the dimer acid is heated up to 260°C at a temperature rising rate of 10°C/min. The solvent (S) includes a solvent (S1) that demonstrates the weight reduction rate of at least 99 mass% in a thermogravimetric analysis in which the solvent (S1) is heated up to 150°C at a temperature rising rate of 6°C/min.
Inventors:
KAWANAGO TOMOHISA (JP)
KAJIKAWA YASUHIRO (JP)
SATO KUNIAKI (JP)
SHIRAKAWA AYAKA (JP)
KAJIKAWA YASUHIRO (JP)
SATO KUNIAKI (JP)
SHIRAKAWA AYAKA (JP)
Application Number:
PCT/JP2023/030134
Publication Date:
February 29, 2024
Filing Date:
August 22, 2023
Export Citation:
Assignee:
SENJU METAL INDUSTRY CO (JP)
International Classes:
B23K35/363; B23K35/26; C22C13/00; C22C28/00; H01L23/373
Foreign References:
| CN105855749A | 2016-08-17 | |||
| JP6540789B1 | 2019-07-10 | |||
| JP6501003B1 | 2019-04-17 | |||
| JP2020040105A | 2020-03-19 | |||
| JP2015085353A | 2015-05-07 | |||
| CN101695794A | 2010-04-21 |
Attorney, Agent or Firm:
OIKAWA Shu et al. (JP)
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