Title:
LEAD-FREE SOLDER ALLOY, PREPARATION METHOD THEREFOR AND USE THEREOF
Document Type and Number:
WIPO Patent Application WO/2023/103289
Kind Code:
A1
Abstract:
A lead-free solder alloy comprises Ag, Cu, Sb, In, Co, B and Sn elements, and the content of each element in weight percentage is: 1.0-4.0% of Ag, 0.2-0.8% of Cu, 1.0-5.0% of Sb, 1.0- 3.0% of In, 0.01-0.5% of Co, and 0.001-0.05% of B and the balance being Sn and unavoidable impurities. The lead-free solder alloy can effectively improve the strength of the solder, reduce the precipitation of the brittle phase of the solder at a low temperature, and also improve the welding interface, so that the lead-free solder alloy has excellent high and low temperature cycle and impact resistance, and is particularly applicable to electronic devices in harsh environments. The invention further relates to a preparation method for the lead-free solder alloy, and a use thereof.
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Inventors:
ZHANG FUWEN (CN)
ZHOU JIACHENG (CN)
XU LEI (CN)
LI ZHIGANG (CN)
WANG ZHIGANG (CN)
HU QIANG (CN)
HE HUIJUN (CN)
ZHOU JIACHENG (CN)
XU LEI (CN)
LI ZHIGANG (CN)
WANG ZHIGANG (CN)
HU QIANG (CN)
HE HUIJUN (CN)
Application Number:
PCT/CN2022/093343
Publication Date:
June 15, 2023
Filing Date:
May 17, 2022
Export Citation:
Assignee:
BEIJING COMPO ADVANCED TECH CO LTD (CN)
International Classes:
B23K35/26; C22C13/00
Foreign References:
| CN114227057A | 2022-03-25 | |||
| CN109396687A | 2019-03-01 | |||
| US20030230361A1 | 2003-12-18 | |||
| US20060263234A1 | 2006-11-23 | |||
| KR20200082107A | 2020-07-08 | |||
| CN101831574A | 2010-09-15 | |||
| CN101801589A | 2010-08-11 | |||
| CN1369351A | 2002-09-18 | |||
| CN103624415A | 2014-03-12 |
Attorney, Agent or Firm:
BEIJING CHEN QUAN INTELLECTUAL PROPERTY LAW FIRM (CN)
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