Title:
SOLDER ALLOY, JOINT PART, JOINTING MATERIAL, SOLDER PASTE, JOINT STRUCTURE, AND CONTROL DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/243104
Kind Code:
A1
Abstract:
This solder alloy has a liquidus temperature of at most 170ºC and can form a joint part having heat cycle resistance and drop impact resistance. The solder alloy contains 45-63 mass% of Bi, 0.1-1 mass% of Sb, 0.05-1 mass% of Cu, and a total of 0.001-0.1 mass% of one or more selected from among Ni and Co, with the remainder consisting of Sn and inevitable impurities, and has a liquidus temperature of at most 170ºC.
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Inventors:
SHIMAZAKI TAKANORI (JP)
MARUYAMA DAISUKE (JP)
OCHI GENKI (JP)
ARAI MASAYA (JP)
MARUYAMA DAISUKE (JP)
OCHI GENKI (JP)
ARAI MASAYA (JP)
Application Number:
PCT/JP2022/024426
Publication Date:
December 21, 2023
Filing Date:
June 17, 2022
Export Citation:
Assignee:
TAMURA SEISAKUSHO KK (JP)
International Classes:
C22C12/00; B23K35/26; C22C13/02
Domestic Patent References:
| WO2019171978A1 | 2019-09-12 | |||
| WO2018174162A1 | 2018-09-27 | |||
| WO2020047481A1 | 2020-03-05 |
Foreign References:
| JP2017177211A | 2017-10-05 | |||
| JP2018023987A | 2018-02-15 | |||
| CN105195915A | 2015-12-30 |
Attorney, Agent or Firm:
OTA Yoko (JP)
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