Title:
SOLDER PASTE AND METHOD FOR PRODUCING ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/270282
Kind Code:
A1
Abstract:
A solder paste according to the present invention contains a flux composition and a solder powder and is configured such that, with respect to a flux residue that is obtained from this solder paste in accordance with a specific production procedure, if G'100 is the storage elastic modulus thereof at 100°C and G"100 is the loss elastic modulus thereof at 100°C as determined under specific measurement conditions with use of a rheometer, G'100 and G"100 satisfy G'100 > G"100.
Inventors:
ASAMI AI (JP)
SAKUMA HARUYA (JP)
YOSHIDA HISAHIKO (JP)
TAKAKI AKIKO (JP)
SAKUMA HARUYA (JP)
YOSHIDA HISAHIKO (JP)
TAKAKI AKIKO (JP)
Application Number:
PCT/JP2022/022745
Publication Date:
December 29, 2022
Filing Date:
June 06, 2022
Export Citation:
Assignee:
SENJU METAL INDUSTRY CO (JP)
International Classes:
C22C13/00; B23K35/22; B23K35/26; B23K35/363; H05K3/34
Domestic Patent References:
| WO2011071006A1 | 2011-06-16 |
Foreign References:
| JP2018153845A | 2018-10-04 | |||
| JP2020044562A | 2020-03-26 | |||
| JP2017177166A | 2017-10-05 | |||
| JP2021049581A | 2021-04-01 | |||
| JP2019025484A | 2019-02-21 | |||
| JP2021178336A | 2021-11-18 |
Attorney, Agent or Firm:
HAYAMI Shinji (JP)
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