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Title:
FLUX AND SOLDER PASTE
Document Type and Number:
WIPO Patent Application WO/2022/255234
Kind Code:
A1
Abstract:
The present invention uses a flux which contains a rosin, a rosin amine, one or more types of organic sulfonic acid selected from the group consisting of an alkane sulfonic acid, an alkanol sulfonic acid, and an aromatic sulfonic acid, a thixotropic agent, and a solvent, wherein: the rosin content is 5-50 mass%, inclusive, of the total amount (100 mass%) of the flux; the rosin amine content is 5-30 mass%, inclusive, of the total amount (100 mass%) of the flux, the organic sulfonic acid content is 0.2-10 mass%, inclusive, of the total amount (100 mass%) of the flux, and the proportion (mass ratio) of the rosin amine content to the organic sulfonic acid content is 3.33-10, inclusive.

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Inventors:
YAMAGAME TOMOHIRO (JP)
AKATSUKA SHUTA (JP)
OKADA SAKIE (JP)
SHINOZAKI KEISUKE (JP)
INOUE KENTA (JP)
Application Number:
PCT/JP2022/021679
Publication Date:
December 08, 2022
Filing Date:
May 27, 2022
Export Citation:
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Assignee:
SENJU METAL INDUSTRY CO (JP)
International Classes:
C22C13/00; B23K35/26; B23K35/363
Foreign References:
JPH0386390A1991-04-11
CN104476017A2015-04-01
JP2021053653A2021-04-08
CN108296672A2018-07-20
JP2021091197A2021-06-17
JPH08503168A1996-04-09
Attorney, Agent or Firm:
OIKAWA Shu et al. (JP)
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