Title:
ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/038665
Kind Code:
A1
Abstract:
This electronic device comprises: a first electronic component that has an Ni-based electrode; and a second electronic component that is joined to the Ni-based electrode via Sn-based solder, wherein a (Cu, Ni, Pd)6Sn5 compound layer is present at the interface of a part where the Ni-based electrode and the Sn-based solder are joined, and the content of Pd present as a (Pd, Ni)Sn4 compound is lower than the content of Pd present as the (Cu, Ni, Pd)6Sn5 compound layer or is zero in the matrix phase of the Sn-based solder after joining.
Inventors:
IKEDA OSAMU (JP)
KANEKO YUJIRO (JP)
TAKAGI YUSUKE (JP)
KANEKO YUJIRO (JP)
TAKAGI YUSUKE (JP)
Application Number:
PCT/JP2023/021219
Publication Date:
February 22, 2024
Filing Date:
June 07, 2023
Export Citation:
Assignee:
HITACHI ASTEMO LTD (JP)
International Classes:
H01L21/52; B23K35/26; C22C13/00; C22C13/02; H01L21/60; H01L23/12; H01L25/07; H01L25/18
Domestic Patent References:
| WO2016079881A1 | 2016-05-26 |
Foreign References:
| JP2008098212A | 2008-04-24 | |||
| JP2011044624A | 2011-03-03 | |||
| JP2016111072A | 2016-06-20 | |||
| JP2021027195A | 2021-02-22 | |||
| JP2013076135A | 2013-04-25 | |||
| JP2017130547A | 2017-07-27 | |||
| JP2019013960A | 2019-01-31 |
Attorney, Agent or Firm:
SUNNEXT INTERNATIONAL PATENT OFFICE (JP)
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