Title:
MOUNTING SUBSTRATE, CONNECTION STRUCTURE, AND ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2023/190475
Kind Code:
A1
Abstract:
[Problem] To provide a mounting substrate that does not easily have a connection failure due to misalignment even when a minute installation component is mounted. [Solution] A mounting substrate according to the present invention is for mounting an installation component and comprises: a circuit substrate on which a plurality of electrodes are arranged at a prescribed interval; and a resin layer that includes a plurality of openings on a top region of the electrodes on the circuit substrate. The mounting substrate is characterized in that conditional expression (1) is satisfied, where the openings of the resin layer have a size of X μm long and Y μm wide, and the installation component has a size of x μm long and y μm wide.
Inventors:
OBUCHI KENTARO (JP)
ARAI YASUAKI (JP)
SHIMAMIYA MARIKO (JP)
OZAWA SATSUKI (JP)
ARAI YASUAKI (JP)
SHIMAMIYA MARIKO (JP)
OZAWA SATSUKI (JP)
Application Number:
PCT/JP2023/012435
Publication Date:
October 05, 2023
Filing Date:
March 28, 2023
Export Citation:
Assignee:
TAIYO HOLDINGS CO LTD (JP)
International Classes:
C22C13/02; H05K3/28; H05K3/32
Domestic Patent References:
| WO2012144493A1 | 2012-10-26 | |||
| WO2019142724A1 | 2019-07-25 |
Foreign References:
| JP2016021555A | 2016-02-04 | |||
| JP2019169541A | 2019-10-03 | |||
| JP2012109549A | 2012-06-07 |
Attorney, Agent or Firm:
MIYAJIMA Manabu et al. (JP)
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