Title:
FLUX AND SOLDER PASTE
Document Type and Number:
WIPO Patent Application WO/2024/019147
Kind Code:
A1
Abstract:
Flux according to the present invention is characterized by containing rosin, a solvent, a thixo agent, an amine hydriodide, and an active agent (other than the amine hydriodide), the amine hydriodide including a complex alicyclic amine hydriodide. The complex alicyclic amine hydriodide is preferably at least one selected from the group consisting of piperidine hydriodide and pipecoline hydriodide. Employing such flux makes it possible to further suppress the generation of voids during soldering.
Inventors:
SAITO RYO (JP)
NAGAI TOMOKO (JP)
TAKEMASA TETSU (JP)
TAKAGI KAZUYORI (JP)
HASHIMOTO YUTAKA (JP)
MIYAGI NANAKO (JP)
KANEKO MUTSUKI (JP)
HAYAKAWA MEGUMI (JP)
MASAKI TSUYOSHI (JP)
NAGAI TOMOKO (JP)
TAKEMASA TETSU (JP)
TAKAGI KAZUYORI (JP)
HASHIMOTO YUTAKA (JP)
MIYAGI NANAKO (JP)
KANEKO MUTSUKI (JP)
HAYAKAWA MEGUMI (JP)
MASAKI TSUYOSHI (JP)
Application Number:
PCT/JP2023/026796
Publication Date:
January 25, 2024
Filing Date:
July 21, 2023
Export Citation:
Assignee:
SENJU METAL INDUSTRY CO (JP)
International Classes:
B23K35/363; B23K35/26; C22C13/00
Foreign References:
| JP2014117737A | 2014-06-30 | |||
| JPS52128859A | 1977-10-28 | |||
| JPH0494891A | 1992-03-26 | |||
| JP2013126671A | 2013-06-27 | |||
| JP2003001487A | 2003-01-08 |
Attorney, Agent or Firm:
OIKAWA Shu et al. (JP)
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