| Document |
Document Title |
|
WO/2024/082896A1 |
An alkali-soluble resin, a photosensitive resin composition, and a photosensitive cured film. The alkali-soluble resin has a structure represented by general formula (1), wherein Ar1 represents a dianhydride residue; R1 represents H or a...
|
|
WO/2024/083404A1 |
A lithographic apparatus comprising a reflector for reflecting radiation. The reflector comprises a body, a reflective surface arranged on the body, and a channel formed in the body for conveying a fluid. The lithographic apparatus compr...
|
|
WO/2024/085389A1 |
The present invention is provided to increase reliability and a lifespan as a display having vivid colors and high resolution by implementing a colored pattern on an electrode substrate. The present invention provides a method for manufa...
|
|
WO/2024/083437A1 |
Described herein is a method for die-to-die (D2D) image alignment using a defect map associated with an image. The method includes accessing a set of images of a substrate, which correspond to different image capture conditions. The loca...
|
|
WO/2024/085388A1 |
The present invention relates to a display with not only vivid colors but also high resolution by implementing a colored pattern on an electrode substrate, so as to improve reliability and lifespan. The present invention relates to a met...
|
|
WO/2024/083559A1 |
A source selection module comprising an adjustable diffraction element comprising multiple pixels. The source selection module further comprises a light dispersive element configured for receiving a first and a second light. The light di...
|
|
WO/2024/085055A1 |
The purpose of the present invention is to, when a substrate (or substrates) is (are) disposed on a substrate holder for holding the substrate(s), detect the position(s) of the substrate(s) disposed in various forms, in which, for exampl...
|
|
WO/2024/085292A1 |
The present invention relates to a chemically amplified positive photoresist composition for improving a pattern profile and enhancing adhesion, the photoresist composition being exposable by a light source with a wavelength of 248 nm, a...
|
|
WO/2024/086571A1 |
Embodiments of the present disclosure generally relate to lithography systems. More particularly, embodiments of the present disclosure relate to a method, a system, and a software application for a lithography process to control transmi...
|
|
WO/2024/085390A1 |
The purpose of the present invention is to improve the reliability and lifespan of a display having not only vivid colors but also high resolution by implementing a colored pattern on an electrode substrate. The present invention relates...
|
|
WO/2024/072716A3 |
Disclosed is an apparatus for adjusting the position or orientation of an internal component across a pressurized wall in a system sealed to contain a controlled internal environment, wherein a through-the-wall adjuster projecting out of...
|
|
WO/2024/084993A1 |
A radiation-sensitive composition comprising a polymer having: a side chain including an acid-dissociable group; and a side chain including one or more radiation-sensitive onium cation structures and two or more iodo groups.
|
|
WO/2024/083470A1 |
A particle transfer system, including: a particle trap apparatus configured to trap a plurality of particles; and a particle conveyance structure configured to convey the particles in parallel from the particle trap apparatus to a substr...
|
|
WO/2024/084040A1 |
The disclosure relates to an aqueous bioink solution for use in light-based bioprinting applications, comprising: (a) 0.5-95 wt % water-soluble prepolymer; (b) 0.001-5 wt % biocompatible metal acylphosphinate photoinitiator; (c) 0.001-10...
|
|
WO/2024/083435A1 |
Described is a method for predicting a parameter of interest of a manufacturing process for manufacturing integrated circuits. The method comprises: obtaining metrology data relating to the parameter of interest; applying a first predict...
|
|
WO/2024/084636A1 |
A photosensitive resin composition contains a polyamic acid ester and a polymerizable monomer, the polyamic acid ester includes a structural unit (A) derived from tetracarboxylic dianhydride and a structural unit (B) derived from a diami...
|
|
WO/2024/085016A1 |
Provided is a substrate treatment method including a step for developing a substrate wherein a negative-type metal-containing resist film is formed and subjected to an exposure treatment and a heat-treatment after the exposure treatment,...
|
|
WO/2024/086042A1 |
Embodiments of the present disclosure relate to a system, a software application, and methods of digital lithography for semiconductor packaging. The method includes comparing positions of vias and via locations, generating position data...
|
|
WO/2024/085030A1 |
The purpose of the present invention is to provide: a method for producing a semiconductor substrate, the method using a composition which is capable of forming a film that has excellent bending resistance and excellent solubility during...
|
|
WO/2024/084615A1 |
Provided is a photoresist that can form a photoresist layer having both developability and polar solvent resistance while having excellent peel removability as a positive photoresist layer. This composition for forming a photoresist comp...
|
|
WO/2024/082657A1 |
A chip preparation method and system, and a chip, which relate to the technical field of micro-nano fabrication. The method comprises: by means of an exposure mode of laser direct writing, preparing a first bottom circuit of an impedance...
|
|
WO/2024/084970A1 |
Provided are: an active-ray-sensitive or radiation-sensitive resin composition capable of forming a pattern having excellent resolution, LWR performance, and pattern shape; and an active-ray-sensitive or radiation-sensitive film, a patte...
|
|
WO/2024/084796A1 |
Provided are a light source device and a raw material supply unit which can inhibit the impact of debris. This light source device uses energy beam (EB) irradiation to convert a liquid raw material (23) into plasma and extract radiatio...
|
|
WO/2024/085293A1 |
The present invention relates to a photoresist composition that can be exposed with a light source having a wavelength of 248 nm, and to a chemically-amplified positive photoresist composition for pattern profile improvement and etch res...
|
|
WO/2024/084965A1 |
Provided is a technique for forming a diffraction grating using a high-refractive-index material. This method for forming a diffraction grating on a substrate having permeability includes: (a) a step for forming, on the substrate, a fi...
|
|
WO/2024/085254A1 |
The present disclosure relates to a photosensitive resin composition, a photosensitive resin multilayer body, and a method for forming a resist pattern. This photosensitive resin composition contains the following components: (A) an alka...
|
|
WO/2024/085181A1 |
This resist composition contains a resin component (A1) having a structural unit (a0) derived from a compound represented by general formula (a0-1) (In the formula, R is a hydrogen atom, a C1-5 alkyl group, or a C1-5 alkyl halide group; ...
|
|
WO/2024/078813A1 |
An optical arrangement for aberration correction, comprising: a beam dispersing element for spatially dispersing a broadband radiation beam in a first transverse direction; a focusing lens for focusing the broadband radiation beam subseq...
|
|
WO/2024/078895A1 |
There is provided a mirror layer for a lithographic apparatus comprising at least one element which forms a chemical bond with silicon having a bond dissociation energy of at least 447 kJ mol-1. Also provided is a method of manufacturing...
|
|
WO/2024/079925A1 |
The present invention relates to a resin composition comprising a maleimide resin that is compatible even when main skeletons are different from each other. The objective of the present invention is to provide: a curable resin compositio...
|
|
WO/2024/080200A1 |
Provided are: an active-ray-sensitive or radiation-sensitive resin composition comprising a resin (A) that includes an acid-decomposable group and a phenolic hydroxyl group, a resin (B) that does not contain an acid-decomposable group, a...
|
|
WO/2024/078792A1 |
Disclosed is a method of reading out a detection arrangement, said detection arrangement defining a detection area in terms of plurality of pixels. The method comprises receiving scattered radiation on said detection arrangement; dividin...
|
|
WO/2024/078830A1 |
Disclosed herein are embodiments that relate to an electrostatic wafer clamps and methods for forming and modifying electrode structures for electrostatic wafer clamps. Wafer clamps include electrode structures in a dielectric layer with...
|
|
WO/2024/080128A1 |
The present invention addresses the problem of providing an actinic ray-sensitive or radiation-sensitive resin composition from which a resist pattern having a small LWR can be formed. An actinic ray-sensitive or radiation-sensitive resi...
|
|
WO/2024/078818A1 |
An inspection system includes an integrated optical system with a substrate, waveguide system, and first and second grating couplers disposed on the substrate, first and second detectors, and a micro-structured illumination adjuster. The...
|
|
WO/2024/078946A1 |
Device comprising: a surface for supporting a wafer; a gas inlet in the surface; a plurality of suction devices for gripping the wafer above the surface and drawing or pulling the wafer towards the surface; a shared vacuum line in fluid ...
|
|
WO/2024/079923A1 |
The purpose of the present invention is to provide a bismaleimide compound-containing resin composition that can be patterned with light, has a glass transition temperature of 200°C or higher, and has a low dielectric dissipation factor...
|
|
WO/2024/078802A1 |
Disclosed herein is a stand-alone qualification system for determining at least one operating characteristic of a fluid extraction system of a substrate support, the qualification system comprising: an extraction support system configure...
|
|
WO/2024/077801A1 |
The present disclosure relates to the technical field of semiconductors, and provides an overlay mark inspection method and device. The method comprises: according to first mark patterns in a first comparison region and second mark patte...
|
|
WO/2024/079926A1 |
The purpose of the present invention is to provide a bismaleimide compound-containing resin composition that has excellent compatibility, that can be cured by means of light, and that requires less heating time and an additional heating ...
|
|
WO/2024/081764A1 |
Spectral data associated with a first prior substrate and/or a second prior substrate is obtained. A metrology measurement value associated with the first portion of the first prior substrate is determined based on one or more metrology ...
|
|
WO/2024/074443A1 |
The invention relates to a method for forming a fluoride or oxylfluoride layer (1) for an optical element (2) for use in the VUV wavelength range, having the steps of: depositing an cxide layer (4) and converting the oxide layer (4) into...
|
|
WO/2024/075733A1 |
[Problem] The purpose of the present invention is to provide a resist underlayer film-forming composition that can further improve properties of a resist underlayer film, such as curing properties, heat resistance, etching resistance, pl...
|
|
WO/2024/075626A1 |
Provided is photosensitive element comprising a support film, a barrier layer, and a photosensitive layer in the given order, wherein the number of particles having a diameter of at least 0.8 μm measured on the barrier layer-side surfac...
|
|
WO/2024/075837A1 |
Provided is a colored resin composition in which decreases in light exposure sensitivity are small even when the composition is stored over time after the preparation thereof. The colored resin composition contains (A) a coloring agent, ...
|
|
WO/2024/075598A1 |
This surface observation method comprises a step a) and a step b). In the step a), materials including one or more kinds of solid light-emitting dye molecules are accumulated in a region, of a substrate or a structure on the substrate, h...
|
|
WO/2024/074440A1 |
The invention relates to a method for the post-treatment of a fluoride layer (1) for an optical element (2) for use in the VUV wavelength range, having the step of: irradiating the fluoride layer (1) with UV/VUV radiation (8) in the pres...
|
|
WO/2024/075581A1 |
The present invention is a photosensitive resin composition characterized: by comprising (A) a silicone resin having a phenolic hydroxyl group, (B) a photoacid generator, and (C) quantum dots; and in that the quantum dots have a surface-...
|
|
WO/2024/074306A1 |
The invention relates to a mirror, in particular for a microlithographic projection exposure apparatus, and to a method of processing a mirror. In one aspect, the mirror has an optical effective surface (11, 21, 31), a mirror substrate (...
|
|
WO/2024/076091A1 |
A reentrant structure continuous patterning apparatus according to one embodiment of the present invention comprises: a patterning unit for applying a first resin onto one surface of a first substrate film continuously fed through a roll...
|
