Title:
ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, PATTERN-FORMING METHOD, AND ELECTRONIC DEVICE PRODUCTION METHOD
Document Type and Number:
WIPO Patent Application WO/2024/080128
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing an actinic ray-sensitive or radiation-sensitive resin composition from which a resist pattern having a small LWR can be formed. An actinic ray-sensitive or radiation-sensitive resin composition according to the present invention comprises: a resin of which the polarity increases due to the action of an acid; a photoacid generator that includes an anion and a cation and generates an acid when irradiated with an actinic ray or radiation; a first acid diffusion control agent including a first anion and a first cation; and a second acid diffusion control agent including a second anion and a second cation. The first anion has a predetermined alicyclic structure that includes multiple rings and is optionally substituted. The ClogP value of the first anion is at most -1.50. The volume of the second anion is greater than that of the first anion. The volume of the second anion is at least 250 Å3.
Inventors:
TAKAKI ASAHI (JP)
TANGO NAOHIRO (JP)
MARUMO KAZUHIRO (JP)
TANGO NAOHIRO (JP)
MARUMO KAZUHIRO (JP)
Application Number:
PCT/JP2023/034808
Publication Date:
April 18, 2024
Filing Date:
September 26, 2023
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/004; C07D307/00; C07D317/72; C07D333/76; C07D409/06; G03F7/038; G03F7/039; G03F7/20
Domestic Patent References:
WO2020158313A1 | 2020-08-06 | |||
WO2014188762A1 | 2014-11-27 | |||
WO2010119910A1 | 2010-10-21 |
Attorney, Agent or Firm:
ITOH Hideaki et al. (JP)
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