Title:
PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, METHOD FOR PRODUCING PATTERNED CURED PRODUCT, AND ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2024/084636
Kind Code:
A1
Abstract:
A photosensitive resin composition contains a polyamic acid ester and a polymerizable monomer, the polyamic acid ester includes a structural unit (A) derived from tetracarboxylic dianhydride and a structural unit (B) derived from a diamine compound, at least part of the structural unit (A) has an unsaturated double bond, and the polyamic acid ester satisfies the following (1) or (2). (1) The structural unit (A) includes a structural unit (A1-1) in which two acid anhydride groups contained in the tetracarboxylic dianhydride are not bonded to an aromatic ring. (2) The structural unit (A) does not include an aromatic ring, or includes a structural unit (A1-2) in which the ratio of the molecular weight of the aromatic ring contained in the tetracarboxylic dianhydride to the molecular weight of the tetracarboxylic dianhydride is 0.5 or less.
Inventors:
SHIBANUMA KOSUKE (JP)
TAHARA SHINGO (JP)
TAHARA SHINGO (JP)
Application Number:
PCT/JP2022/039002
Publication Date:
April 25, 2024
Filing Date:
October 19, 2022
Export Citation:
Assignee:
HD MICROSYSTEMS LTD (JP)
International Classes:
G03F7/027
Foreign References:
| JP2018045230A | 2018-03-22 | |||
| JP2017115163A | 2017-06-29 | |||
| CN114561009A | 2022-05-31 |
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
Download PDF: