Title:
ALKALI-SOLUBLE RESIN, PHOTOSENSITIVE RESIN COMPOSITION, AND PHOTOSENSITIVE CURED FILM
Document Type and Number:
WIPO Patent Application WO/2024/082896
Kind Code:
A1
Abstract:
An alkali-soluble resin, a photosensitive resin composition, and a photosensitive cured film. The alkali-soluble resin has a structure represented by general formula (1), wherein Ar1 represents a dianhydride residue; R1 represents H or an organic group having 1-10 C atoms; m is an integer of 10-10000, and r is an integer of 0-2; Ar2 represents a diamine residue, the diamine residue comprises at least two structural units, and one structural unit is as represented by general formula (2); and Ar1 and Ar2 contain at least one phenolic hydroxyl group. The structural unit represented by general formula (2) is introduced into the alkali-soluble resin structure, and comprises a siloxane structure, an aromatic structure and/or a fluorine-containing substituent structure, so that when the structural unit is applied to a photosensitive resin composition to form a cured film, good adhesion with a substrate is achieved, good transparency is achieved, and good heat resistance and low-temperature curing characteristics after curing are guaranteed.
Inventors:
YOU WEITAO (CN)
WANG JUNJIE (CN)
HAN GUANGTAO (CN)
JI CHANGWEI (CN)
CHEN ZHENGMING (CN)
WANG JUNJIE (CN)
HAN GUANGTAO (CN)
JI CHANGWEI (CN)
CHEN ZHENGMING (CN)
Application Number:
PCT/CN2023/119327
Publication Date:
April 25, 2024
Filing Date:
September 18, 2023
Export Citation:
Assignee:
SHANGHAI BAYI SPACE ADVANCED MAT CO LTD (CN)
International Classes:
G03F7/075
Domestic Patent References:
WO2021246459A1 | 2021-12-09 |
Foreign References:
CN112180685A | 2021-01-05 | |||
CN111812943A | 2020-10-23 | |||
CN112180684A | 2021-01-05 | |||
CN114195688A | 2022-03-18 | |||
CN114380998A | 2022-04-22 | |||
CN114561008A | 2022-05-31 | |||
CN115073732A | 2022-09-20 | |||
CN115343914A | 2022-11-15 | |||
CN108885401A | 2018-11-23 | |||
JP2004361883A | 2004-12-24 | |||
US20040175646A1 | 2004-09-09 |
Download PDF: