Title:
ACTIVE-RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTIVE-RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMATION METHOD, AND ELECTRONIC DEVICE MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2024/084970
Kind Code:
A1
Abstract:
Provided are: an active-ray-sensitive or radiation-sensitive resin composition capable of forming a pattern having excellent resolution, LWR performance, and pattern shape; and an active-ray-sensitive or radiation-sensitive film, a pattern formation method, and an electronic device manufacturing method, in each of which the active-ray-sensitive or radiation-sensitive resin composition is used. The active-ray-sensitive or radiation-sensitive resin composition comprises a resin which is decomposed by the action of an acid, exhibits changes in the polarity, and contains a repeating unit having a specific structure and also comprises a compound that has a specific structure and generates an acid when irradiated with an active ray or a radioactive ray. The active-ray-sensitive or radiation-sensitive film, the pattern formation method, and the electronic device manufacturing method each use the active-ray-sensitive or radiation-sensitive resin composition.
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Inventors:
FUKUZAKI EIJI (JP)
Application Number:
PCT/JP2023/036207
Publication Date:
April 25, 2024
Filing Date:
October 04, 2023
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/004; C08F12/22; C08F20/10; C08F20/54; G03F7/039; G03F7/20
Domestic Patent References:
| WO2021220851A1 | 2021-11-04 | |||
| WO2021199789A1 | 2021-10-07 | |||
| WO2021065549A1 | 2021-04-08 |
Attorney, Agent or Firm:
KOH-EI, P.C. (JP)
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