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WO/2024/025150A1 |
Provided is a cured film having a novel parameter derived therefor so as to improve device reliability. One embodiment of the present invention provides a cured film made by curing a photosensitive resin composition, wherein the photosen...
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WO/2024/024669A1 |
The present invention provides: an actinic ray-sensitive or radiation-sensitive resin composition containing a resin (A) the polarity of which is increased by action of acid and a specific compound (B) represented by a general formula (B...
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WO/2024/024483A1 |
This resist pattern inspection method comprises an appearance inspection step for inspecting the appearance of a resist pattern on the basis of light emitted from a substrate whereon the resist pattern is formed. The resist pattern manuf...
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WO/2024/024440A1 |
The present invention provides a silicone-containing copolymer that makes it possible to reduce environmental impact and that provides the effect of suppressing the occurrence of foreign matter due to sublimation of a pigment in a coatin...
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WO/2024/024490A1 |
A composition for forming a resist underlayer film, the composition containing a polymer having an alicyclic structure in locations other than terminals, and a solvent.
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WO/2024/018957A1 |
Provided is a novel composition for forming a resist underlayer film. The composition for forming a resist underlayer film contains a compound P that has a partial structure having a phenolic hydroxyl group on a benzene ring and at least...
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WO/2024/017649A1 |
Disclosed is a metrology apparatus in which some of the measurement radiation that has interacted with a mark is split into channels or arms and then each channel or arm is spatially separated. In some versions the alignment information ...
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WO/2024/019930A1 |
A method of reactive developing a metal oxide resist includes providing a gaseous weak acid to a surface of a patterned metal oxide resist including an exposed portion and an unexposed portion, the gaseous weak acid having an acidity (pK...
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WO/2024/019064A1 |
Provided is a silicon-containing resist underlayer film-forming composition comprising: a polysiloxane as a component [A]; sulfuric acid, a polyfunctional sulfonic acid, or a salt thereof as a component [B]; and a solvent as a component ...
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WO/2024/017836A1 |
The invention relates to an optical system (100) for a projection exposure apparatus (1), the optical system comprising a first component (102), a second component (104) and a compensation device (200, 300) which is arranged between the ...
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WO/2024/017808A1 |
A method of determining a mask design is described. The method comprises generating a continuous multimodal representation of a probability distribution of a target design in at least a portion of a latent space. The latent space compris...
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WO/2024/017505A1 |
The invention is directed to a process for manufacturing a strain or thermal sensor (1) by inkjet-printing SU-8 (4) over a substrate (2) and embedding a silver pattern (6) in an SU-8 encapsulating layer (8). The invention also relates to...
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WO/2024/017606A1 |
Residual gas analyser, especially for analysing a residual gas in a microlithography projection exposure apparatus, comprising a mass spectrometer (27) and an admission device (28, 29, 24) for admitting constituents of the residual gas f...
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WO/2024/019866A1 |
Embodiments disclosed herein include a method of monitoring a photoresist deposition process. In an embodiment, the method comprises depositing a photoresist layer to a first thickness over a substrate, measuring a property of the photor...
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WO/2024/017921A1 |
A developer tolerance resist underlayer composition comprising a polymer (A), a cross-linking agent (B), a thermal acid generator (C) and a solvent (D): wherein the polymer (A) comprises at least a unit having a protective group that is ...
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WO/2024/018910A1 |
The present invention provides a coloring composition which contains a coloring agent and a resin, wherein the coloring agent contains a compound YA wherein a compound represented by formula (1) is coordinated to a metal atom MA, and a c...
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WO/2024/017560A1 |
The invention relates to a residual gas analyzer, in particular for analyzing a residual gas in an EUV projection exposure apparatus (10, 22), comprising a mass spectrometer (27) and an admission device (29, 34) for admitting ionized con...
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WO/2024/019905A1 |
A dielectric material is a thermoset polymer that is a copolymer of a first monomer and a second monomer. The first monomer can comprise a dipolar functional group having a dipole monomer of about 3.9 Debye or more. The first monomer can...
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WO/2024/016402A1 |
An exposure period adjustment device and method, relating to the field of ultra-precision measurement. The exposure period adjustment device comprises: a control module (900); and first, second, third and fourth electric mirror groups (1...
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WO/2024/017807A1 |
Systems, methods, and computer software are disclosed for optimizing a metrology mark. One method includes simulating an etch process based on one or more of a pattern density, a microloading effect induced intra-mark variation, or a sen...
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WO/2024/019937A1 |
Disclosed is an apparatus for and method of permitting automatic alignment of optical components in the beam path of a laser. Images of the beam are obtained at one or more positions in the beam path. Alignment and possibly other informa...
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WO/2024/012128A1 |
A mask assembly (10), a photolithographic device, and a photolithographic method. By means of a double exposure process, a process window is improved. The mask assembly (10) comprises a first mask (11) and a second mask (12). The first m...
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WO/2024/014462A1 |
This resist composition comprises a resin component (A1) that exhibits change in solubility in a developing solution due to the action of an acid. The resin component (A1) has a constitution unit (a0) derived from a compound represented ...
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WO/2024/015168A1 |
Embodiments disclosed herein include a method of patterning a metal oxo photoresist. In an embodiment, the method comprises depositing the metal oxo photoresist on a substrate, treating the metal oxo photoresist with a first treatment, e...
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WO/2024/012772A1 |
Disclosed is a substrate comprising at least one target. The target comprises a plurality of sub-targets, the plurality of sub-targets comprising at least a first sub-target and second sub-target, each of the plurality of sub-targets com...
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WO/2024/012768A1 |
A substrate holding system for supporting a substrate, the substrate holding system comprising a substrate holder and an evacuation conduit, wherein: the substrate holder comprises: a main body having a surface; a plurality of burls proj...
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WO/2024/013161A1 |
A method is proposed of using low-resolution images of at least one product produced by one or more imaging processes, and imaging models characterizing the imaging processes, to determine values for plurality of numerical parameters whi...
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WO/2024/013038A1 |
A method for stochastic-aware source mask optimization is described. A probability distribution for edge placement which accounts for stochasticity is determined. Based on the probability distribution, the source configuration, mask conf...
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WO/2024/014689A1 |
Provided is a photosensitive resin composition, of which both flexibility and sensitivity performance are improved. In general formulas 1 and 2 according to the present invention, at least one of R1 and R2 includes a molecular structure ...
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WO/2024/015173A1 |
Embodiments disclosed herein include a method of optimizing a post deposition bake of a photoresist layer. In an embodiment, the method comprises depositing the photoresist layer on a substrate, baking the photoresist layer, and measurin...
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WO/2024/014330A1 |
According to the present invention, it is possible to provide a resist auxiliary film composition containing a resin (A) and a solvent (B), the solvent (B) including a compound (B1) represented by general formula (b-1) below, wherein the...
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WO/2024/014331A1 |
The present invention provides a thinner composition containing a solvent (B) that includes a compound (B1) represented by general formula (b-1) below. (In formula (b-1) above, R0 is an alkyl group having 1-10 carbon atoms, an aryl group...
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WO/2024/014346A1 |
A substrate processing device that processes a substrate, comprising: a retaining/rotating part that retains and rotates the substrate; a supply unit including at least one gas nozzle that supplies an inert gas to the substrate after a d...
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WO/2024/013190A1 |
An apparatus (100) for providing sensor data from a number N, with N ≥ 1, of sensors (301-30N) of an optical system (4, 10) of a lithography apparatus (1), comprising an analogue-to-digital converter (500), which is configured to conve...
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WO/2024/012965A1 |
Disclosed herein is a system, comprising: a charged-particle beam inspection apparatus configured to scan a sample that comprises a target with a plurality of pattern layers; and a controller including circuitry, configured to: obtain de...
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WO/2024/013177A1 |
The invention relates to a projection exposure apparatus (1, 101) having a heating device (40) for heating at least one element (Mx, 117) of the projection exposure ap- paratus (1, 101) by means of electromagnetic radiation, the heating ...
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WO/2024/014329A1 |
The present invention provides a resist composition which contains a resin (A) and a solvent (B) containing a compound (B1) represented by general formula (b-1), and which contains an active ingredient in an amount of 45 mass% or less wi...
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WO/2024/012820A1 |
The invention relates to a lens element for a microlithographic projection exposure apparatus designed for operation in the DUV, and a method and an arrangement for forming an antireflection layer. In accordance with one aspect, in the c...
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WO/2024/012756A1 |
An assembly for movably supporting a mirror comprises: a mirror; and one or more deformable members. A first end of the or each deformable member defines a support portion and a second end of the or each deformable member is attached (ei...
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WO/2024/013273A1 |
Described herein are methods and systems for determining mask rule check (MRC) violations associated with mask features based on local feature dimension (LFD) of mask features. A detector is placed at a first location of a mask feature a...
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WO/2024/012800A1 |
Described herein is a method for predicting post-etch stochastic variation in transferring a target layout onto a substrate using a lithographic apparatus. The method includes predicting a stochastic variation in transferring a target la...
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WO/2024/012978A1 |
A mirror for a projection exposure apparatus has a spectral filter, embodied as a grating structure (30), for light reflected by the mirror. The grating structure (30) has at least two grating levels and hence specifies at least two opti...
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WO/2024/008394A1 |
A method of determining a parasitic force of an actuator (320) of an optical component (300) is described, whereby the actuator is mounted to a first frame (310) and is configured to control a position of the optical component relative t...
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WO/2024/009674A1 |
A film for manufacturing a flexographic printing plate has a base material and an abrasion layer that is layered on the base material, the abrasion layer contains a resin having a structure unit (1) represented by general formula (1) bel...
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WO/2024/007501A1 |
Provided in the embodiments of the present disclosure is an acousto-optic scanning super-resolution optical fiber lithography machine, comprising a control device, a super-resolution optical fiber laser light source, an optical scanning ...
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WO/2024/009432A1 |
Provided is a photosensitive resin composition containing (A) a binder polymer, (B) a photopolymerizable compound having an ethylenically unsaturated bond, and (C) a photopolymerization initiator, wherein the photosensitivity resin compo...
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WO/2024/008732A1 |
The invention relates to a method for controlling a position of an optical component (102) of a lithography system (1) comprising the following steps: a) determining (S3) a first control variable (ur) based on a deviation (e) of an actua...
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WO/2024/008360A1 |
The invention relates to an optical element (Mx, 117) for a projection exposure system for semiconductor lithography (1, 101) comprising a base element (30) and at least one actuator (40) connected to the base element (30), wherein the a...
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WO/2024/007502A1 |
Provided in the embodiments of the present disclosure is a non-mechanical optical scanning fiber photolithography machine, comprising a control apparatus, a laser light source, an optical scanning system and an electrically driven workpi...
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WO/2024/009993A1 |
This method of manufacturing a laminate that has a surface-modified layer and a semiconductor substrate comprises: a first step in which a semiconductor substrate is coated with a surface modifier containing a polymer and a solvent, and ...
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