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WO/2023/054331A1 |
Provided is a thermoplastic polyurethane for a polishing layer in which the D hardness in a sheet with a thickness of 2 mm after saturating the sheet with water at a temperature of 50ºC and causing the sheet to swell is less than 50, an...
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WO/2023/052421A1 |
The present invention relates to a method for grinding an elongate workpiece (14), comprising the following steps: - clamping the workpiece (14), wherein the workpiece (14) is supported at a first workpiece end (82) in a first workpiece ...
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WO/2023/055070A1 |
The present invention provides a Zn-Mg-Al-based plated steel sheet excellent in corrosion resistance and excellent in at least one of weldability and phosphatability, and a manufacturing method therefor.
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WO/2023/055663A1 |
A chemical mechanical planarization (CMP) pad conditioner assembly includes a backing plate including at least one polymer and at least one additive. The at least one additive is present in an amount sufficient to result in a backing pla...
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WO/2023/055649A1 |
A CMP pad conditioner assembly includes a backing plate including a first face including a plurality of first mounting locations and a second face including a plurality of second mounting locations. A plurality of segments is secured to ...
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WO/2023/054562A1 |
A polishing device (10) comprises: a wafer-holding part (31) that holds a wafer (W) and brings the held wafer (W) into contact with a polishing surface (22a); a surface plate drive unit (24) or a head drive unit (34) that rotates the waf...
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WO/2023/055274A1 |
A method and a device for induced formation of solid lubricant comprises providing (S10) of an article (10) to be processed. The article is exposed (S20) to a process fluid (34) comprising a solvent, impact media (20) and additives of so...
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WO/2023/051960A1 |
The invention relates to a machine for machining sheet metal parts, comprising a brush unit (70) having at least one horizontally rotating polishing brush (71) for brushing the surface of the sheet metal parts to be machined. In order to...
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WO/2023/049317A1 |
The invention provides a chemical-mechanical polishing composition comprising: (a) about 3.0 wt.% to about 10 wt.% silica abrasive; (b) an anionic polymer having a weight average molecular weight of about 400 kDa to about 7000 kDa; and (...
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WO/2023/046937A1 |
A method for machining optical workpieces, in which a semifinished product (HZ) having predetermined surface geometries on the front side (FS) and rear side (RS) and a contoured edge (RA) of predetermined edge thickness (D2) therebetween...
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WO/2023/048700A1 |
Apparatus (100, 600, 700, 1000) and method (500, 1200) for sharpening a cutting edge (20, 412, 446, 456, 466, 476, 1080A, 1100 A) of a cutting tool (10, 390, 400, 440, 450, 460, 470A, 470B, 470C, 626, 726, 820, 1050, 1070), such as a kit...
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WO/2023/047640A1 |
A method for manufacturing a chamfering wheel includes: forming concentrically, by coaxial machining, a reference surface that is one of a pair of side surfaces of a disc, a fitting hole through which a rotary shaft part is fitted in the...
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WO/2023/048266A1 |
Provided is a polishing pad comprising a polishing layer that is a molded article of a polyurethane composition. The polyurethane composition contains 90-99.9 mass% of a thermoplastic polyurethane containing a non-alicyclic diisocyanate ...
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WO/2023/049214A1 |
A buffing pad assembly having a buffing pad, an attachment means, and an insert (e.g., plastic ring) is provided. In one embodiment, a channel is cut into a side of the buffing pad, creating first and second side portions. The attachment...
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WO/2023/047682A1 |
The present invention relates to a polishing device, a substrate processing apparatus, and a polishing method. This polishing device comprises a polishing unit 22. The polishing unit 22 comprises: a holding and rotating unit 35 that rota...
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WO/2023/047683A1 |
The present invention relates to a polishing method, and a substrate processing apparatus. This polishing method comprises: a rotation step for rotating a substrate W in a horizontal posture; an etching step for supplying an etching liqu...
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WO/2023/047817A1 |
Provided is a highly durable magnet separator that is unlikely to be affected by foreign matter in a liquid. The magnet separator comprises a separator main body, a magnet drum, and a drive unit. The magnet drum has: a first shaft that...
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WO/2023/047437A1 |
In a processing device (2, 302) for processing a workpiece (W) with a tool (T, T2), a processing estimation device (3, 5, 303) estimates at least one among the condition of the workpiece (W) or the tool (T, T2), the shape of the workpiec...
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WO/2023/047731A1 |
Provided is a simple method for manufacturing an adhesive-layer-attached optical laminate that prevents floating of a release liner. A method for manufacturing an adhesive-layer-attached optical laminate according to an embodiment of the...
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WO/2023/048265A1 |
A polishing pad including a polishing layer that is a molded product of a polyurethane composition, in which the polyurethane composition comprises 90 to 99.9% by mass of a thermoplastic polyurethane containing a non-alicyclic diisocyana...
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WO/2023/047684A1 |
A substrate processing apparatus 1 comprises: an indexer robot that takes a substrate W into and out of a carrier; a polishing unit 22 that polishes a back surface of the substrate while heating the substrate W; and a substrate transport...
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WO/2023/047690A1 |
Dust generated on a reverse face of a substrate by grinding with a grinder 96 is pushed out also toward the outer periphery of the grinder 96 by a centrifugal force. There, nitrogen gas is injected from an injection outlet 235. The dust ...
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WO/2023/041561A1 |
The invention relates to a device (1) for sewage pipe work, comprising: - a base unit (2), which can be moved in a sewage pipe; - a rotary head (3), which is disposed on the base unit (2) and can be rotated about an axis of rotation (A) ...
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WO/2023/042602A1 |
The present invention provides a processing machine in which a machine body drives at least one of a workpiece and a tool to process the workpiece using the tool. A processing chamber houses the workpiece, the tool, and a nozzle while is...
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WO/2023/041891A1 |
A method of manufacturing a moulded article is disclosed. The method comprises forming a body comprising a polymer material. The method further comprises polishing a portion of the body with a polishing element to smooth at least one imp...
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WO/2023/042406A1 |
[Problem] To provide a glass plate machining system where a movement distance of a machining device until arriving at a side edge of a small-sized glass plate where the area of the upper and lower surfaces is small can be shortened, an a...
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WO/2023/042385A1 |
Linear abrasive members (10A, 10B) are used as abrasive members for a polishing brush. The linear abrasive members (10A, 10B) comprise inorganic long fibers and a resin which is cured after having the inorganic long fibers immersed there...
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WO/2023/042384A1 |
Linear abrasive members (10) are used as abrasive members for a polishing brush. The linear abrasive members (10) comprise inorganic long fibers and a resin which is cured after having the inorganic long fibers immersed therein. The inor...
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WO/2023/039779A1 |
A wear-resistant cutter wheel, comprising a cutter wheel body (10) and a cutter wheel shaft (20) connected to the cutter wheel body (10). A center hole (11) into which the cutter wheel shaft (20) is inserted is formed in the center of th...
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WO/2023/035247A1 |
Embodiments of the present disclosure provide a chemical-mechanical polishing device and a control method therefor. The chemical-mechanical polishing device comprises a polishing platform which is adapted to carry a polishing pad and dri...
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WO/2023/038183A1 |
One embodiment of the present invention provides a technology for automatically performing a polishing process by using a robot and controlling the polishing process in real time by monitoring a current value of a spindle in real time. A...
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WO/2023/036903A1 |
A surface processing apparatus (500) comprises: - a surface processing device (200) to process a surface (SRF1), - a robot (ROBO1 ) to move the surface processing device (200) with respect to the surface (SRF1 ), - an electromagnetic act...
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WO/2023/036012A1 |
A wafer polishing system, at least comprising one polishing unit (1), wherein the polishing unit (1) comprises a wafer transmission channel (2) and at least two polishing modules (3); and the polishing modules (3) are located on both sid...
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WO/2023/038800A1 |
Embodiments herein generally relate to polishing pads and methods of forming polishing pads. A polishing pad includes a plurality of polishing elements. Each polishing element comprises an individual surface that forms a portion of a pol...
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WO/2023/036011A1 |
Disclosed in the present invention is a wafer polishing system, at least comprising a polishing unit, which comprises a fixed working station and two polishing modules, wherein the polishing modules are located on two sides of the fixed ...
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WO/2023/037272A1 |
Aspects of the present disclosure relate to a method of making an abrasive article. The method can include providing a combination of a mesh backing and a fastener. The mesh backing has a first side and a second side and the mesh backing...
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WO/2023/035810A1 |
A vertical wall construction method and a construction robot. The method comprises: a construction module (130) constructing an indoor vertical wall surface (S1); detecting an obstacle in the direction of construction, and acquiring posi...
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WO/2023/030999A1 |
The invention relates to a grinding disc for a grinding device (12), having a fastening interface (15) formed on a device side (26) of the grinding disc (11) facing the grinding device (12), wherein: on a working side (27) axially opposi...
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WO/2023/032716A1 |
Provided is a polishing composition which has an excellent ability to eliminate bulging around an HLM, and which can improve polishing rate. The polishing composition comprises abrasive grains, a basic compound, and water. In addition, t...
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WO/2023/032930A1 |
This polishing liquid contains cerium oxide abrasive grains and ammonium salt, and has a pH of at least 9.00. This polishing method uses the polishing liquid to polish a member to be polished that contains copper. This component manufact...
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WO/2023/030774A1 |
A method for grinding a semiconductor wafer, wherein the semiconductor wafer is machined in a material-removing manner by means of a grinding tool containing grinding teeth having a height h while supplying a cooling medium into a contac...
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WO/2023/034874A1 |
Examples are disclosed that relate to planarizing substrates without use of an abrasive. One example provides a method of chemically planarizing a substrate, the method comprising introducing an abrasive-free planarization solution onto ...
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WO/2023/032196A1 |
In a process in which grinding is performed after additive manufacturing, the present invention reduces the amount of a portion of a coating, formed during the additive manufacturing, that exceeds a thickness necessary for a product. Thi...
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WO/2023/034573A1 |
A chemical mechanical polishing pad comprising a polishing portion, the polishing portion comprising: a polymeric body; a plurality of polymer particles embedded within the body of the polymeric body, wherein at least a portion of the pl...
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WO/2023/032715A1 |
Provided is a polishing composition which can achieve both maintenance of a polishing rate and an HLM periphery protrusion elimination ability. This polishing composition contains grains, a basic compound, a salt of a sulfur-containing a...
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WO/2023/032714A1 |
Provided is a polishing composition capable of achieving both maintenance of a polishing rate and elimination of bulging of the periphery of a hard laser mark (HLM), the polishing composition comprising abrasive grains, a basic compound,...
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WO/2023/032197A1 |
This complex grinding machine comprises: a holding unit capable of holding and rotating a workpiece; an additive manufacturing unit that is movable with respect to the holding unit and melts a material while supplying the material to a s...
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WO/2023/032929A1 |
This polishing solution is for polishing a resin-containing polishing target member and contains an ether compound having a hydroxy group, and abrasive grains containing cerium oxide. This polishing method is for polishing a resin-contai...
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WO/2023/032489A1 |
Provided is a method for polishing a spectacle lens, the method having: a step for preparing a polishing pad in which a flocked polishing pad is provided to a polishing surface that comes into contact with a plastic spectacle lens, the f...
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WO/2023/032961A1 |
Provided are a glass member that excels in tactile sensation such as the feel of writing using an input pen and the feel of touching with a fingertip, an input device provided with the glass member, a pen input device, a mobile apparatus...
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